Technology Partner and Leading Printed Circuit Board Manufacturer in North America

Trusted by the world’s most innovative, high-growth companies

Solutions

PCB solutions to support your full product lifecycle.

High-Density Rigid

Summit provides HDI rigid PCBs with microvias, blind/buried vias, back drilling, via fill, metal core, and large panel options.

RF / Microwave

We specialize in semiconductor reference cards, probe cards, DUT, and burn-in-boards. Our RF capabilities include high aspect ratio, low-loss materials, bondable gold, tight tolerance drilling, and sintering.

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Rigid-Flex and Flex

As experts in rigid-flex and flex manufacturing, we handle rigid-flex, bookbinder, multilayer, adhesiveless & adhesive, stiffeners, laser ablation, thin flex laminates, assembly options and more.

Prototype Assembly

Summit provides full turnkey PCB assembly and flexible manufacturing options to help customers complete their projects on time.

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Thermal Management

Summit Interconnect manufactures thermal management PCBs with advanced materials and processes that optimize heat dissipation for reliable performance in demanding, high-power applications.

High-Density Rigid

Summit provides HDI rigid PCBs with microvias, blind/buried vias, back drilling, via fill, metal core, and large panel options.

RF / Microwave

Rigid-Flex and Flex

As experts in rigid-flex and flex manufacturing, we handle rigid-flex, bookbinder, multilayer, adhesiveless & adhesive, stiffeners, laser ablation, thin flex laminates, assembly options and more.

Prototype Assembly

Summit provides full turnkey PCB assembly and flexible manufacturing options to help customers complete their projects on time.

Thermal Management

Summit Interconnect manufactures thermal management PCBs with advanced materials and processes that optimize heat dissipation for reliable performance in demanding, high-power applications.

Markets

A few of the markets we serve

Aerospace & Defense

Summit is one of the most trusted suppliers for key defense programs with advanced technologies across a wide spectrum of platforms.

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Quantum & Datacom Computing

Summit is on the leading edge in the use of modern materials and HDI processes to meet the high-speed digital signal integrity requirements of the computing and datacom markets.

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Automotive &Transportation

Today’s automobiles and electric vehicles are complex products that require advanced electronic components for operations. We are experienced in meeting these complex requirements.

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Medical Devices

Summit has proven experience meeting the manufacturing requirements for medical electronic products including miniaturization with thin dielectrics, laser drilled vias and tight tolerances.

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Commercial Space

Our material expertise and manufacturing knowledge allow Summit’s factories to support 6012/6018 Space Addendum for complex designs of space applications.

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Industrial & Instrumentation

Summit supports industrial and energy systems with HDI, rigid-flex, and thermal PCBs designed for performance, durability, and fast turnaround.

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webinars

Technical webinars

Expert-led webinars provide valuable PCB insights, design recommendations, industry trends, and more

Webinar Recording

Oct. 30, 2025

REGISTER: Designing for Space: Understanding the IPC-6012 Space Addendum

Designing PCBs for aerospace and space applications means engineering for the harshest environments imaginable — vacuum, radiation, thermal extremes, vibration, and shock. Failure is not an option, and the standards reflect that reality. In this technical webinar, Gerry Partida, VP of Technology at Summit Interconnect, will walk design engineers through the most important updates in […]

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Webinar Recording

Sep. 25, 2025

RECORDING: IPC Standards for Quick-Turn, Prototype PCB Assembly

This webinar provides engineers and PCB designers with practical insights into how IPC standards directly impact the speed, quality, and reliability of prototype PCB builds. Attendees will learn which IPC standards are most critical for quick-turn assembly, how compliance can reduce risk and rework, and best practices for applying these standards in a fast-paced development […]

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Webinar Recording

Aug. 22, 2025

RECORDING: How Circuit Boards Are Built

Whether you’re new to PCB design or just need a refresher, this webinar walks you through the real-world process of how your designs are brought to life on the manufacturing floor. Led by Aaron Kennedy, Engineering Manager at Summit Interconnect, this session unpacks the fabrication journey from raw materials to finished circuit boards—highlighting the critical […]

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Webinar Recording

Mar. 13, 2025

Speaker:

RECORDING: Mastering PCB Thermal Management

Managing heat in PCB design is critical for performance, reliability, and product longevity. Summit Interconnect’s webinar explored progressive thermal management techniques—from fundamental material choices to advanced heat dissipation solutions.

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Webinar Recording

Nov. 7, 2024

WEBINAR: Best Practices for HDI and Sub-Lamination Structures

High-density interconnect (HDI) and sub-lamination PCBs provide enhanced functionality and compact designs. In this webinar, industry veteran Gerry Partida, Summit’s Vice President of Technology, discusses important design best practices for HDI and sub-lamination structures.

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Webinar Recording

May. 29, 2025

WEBINAR: Pushing the Limits: High-Density PCB

This exclusive webinar will explore the evolving landscape of high-density PCBs.

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Webinar Recording

Oct. 3, 2024

RECORDING: PCB Tech Match: How to Choose the Right PCB Technology for Your Application

Using the right technology for your PCB application reduces time to market, lowers costs, and delivers the best performance outcomes. In this webinar, industry veterans Mike Trammel, Summit’s Director of Product and Technology Transfer, and Chris Hunrath, Vice President of Technology at Insulectro, review new technologies and capabilities in PCB manufacturing. Learn how to leverage […]

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Webinar Recording

Jul. 25, 2024

RECORDING: The Proliferation of Electronics into Harsh Environments and the Effects on Reliability

For the past 30 years, the use of no-clean fluxes has, for many assemblers, resulted in the successful abandonment of post-reflow cleaning. Today, an increasing number of assemblers are restoring their long-abandoned cleaning process, so much so, that cleaning is now considered by many assemblers, once again, to be a mainstream assembly process. This presentation […]

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Webinar Recording

Jun. 20, 2024

RECORDING: Let It Vent Webinar

Join our VP of Technology, Gerry Partida, as he discusses the challenges of delamination in HDI Design. In this 45-minute webinar exclusively for Summit Interconnect customers, Gerry shares why modern HDI designs with high copper retention and extensive microvias are more prone to moisture entrapment and teaches practical strategies to mitigate these issues and ensure […]

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Webinar Recording

May. 22, 2024

RECORDING: Addressing the Challenges of PCB Design for Manufacturing

We had an excellent turnout at our latest webinar in the series, where we discussed Addressing the Challenges of PCB Design for Manufacturing along with CoFactr. Some topics that were covered include: Common DFx issues seen by manufacturers/fabricators DFx design guidelines to follow In-design DFM checking with DesignTrue DFM technology Automating manufacturing documentation with Live […]

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Why?

Why Summit?

Summit Interconnect is one of the largest PCB manufacturers in North America.

With field application engineers across North America, best-in-class processes, top-of-the-line equipment, and redundant facilities, we are the clear choice when selecting a manufacturer for mission-critical PCB designs today and in the future.