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RECORDING: The Proliferation of Electronics into Harsh Environments and the Effects on Reliability
Click to WatchFor the past 30 years, the use of no-clean fluxes has, for
many assemblers, resulted in the successful abandonment
of post-reflow cleaning.
Today, an increasing number of assemblers are restoring
their long-abandoned cleaning process, so much so, that
cleaning is now considered by many assemblers, once
again, to be a mainstream assembly process.
This presentation will review the reasons cleaning, for many
assemblers, was abandoned, the reasons that decision was
largely successful for such a long time, and the reasons why
that success has faded.
The webinar will be hosted by Summit Interconnect and will be taking place at 11 AM PST, July 25th 2024. Register below.
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REGISTER: Designing for Space: Understanding the IPC-6012 Space Addendum
Designing PCBs for aerospace and space applications means engineering for the harshest environments imaginable — vacuum, radiation, thermal extremes, vibration, and shock. Failure is not an option, and the standards reflect that reality.…
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RECORDING: IPC Standards for Quick-Turn, Prototype PCB Assembly
This webinar provides engineers and PCB designers with practical insights into how IPC standards directly impact the speed, quality, and reliability of prototype PCB builds. Attendees will learn which IPC standards are most…
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