Your connection to advanced PCB manufacturing 
Join our VP of Technology, Gerry Partida, as he discusses the challenges of delamination in HDI Design. In this 45-minute webinar exclusively for Summit Interconnect customers, Gerry shares why modern HDI designs with high copper retention and extensive microvias are more prone to moisture entrapment and teaches practical strategies to mitigate these issues and ensure the reliability of your PCB assemblies.
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REGISTER: Designing for Space: Understanding the IPC-6012 Space Addendum
Designing PCBs for aerospace and space applications means engineering for the harshest environments imaginable — vacuum, radiation, thermal extremes, vibration, and shock. Failure is not an option, and the standards reflect that reality.…
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RECORDING: IPC Standards for Quick-Turn, Prototype PCB Assembly
This webinar provides engineers and PCB designers with practical insights into how IPC standards directly impact the speed, quality, and reliability of prototype PCB builds. Attendees will learn which IPC standards are most…
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