Advanced PCB Assembly Capabilities

Our software-driven facility delivers comprehensive printed circuit board assembly solutions, supporting everything from rapid-turn prototype builds to complex assemblies that require advanced component placement, fine-pitch technologies, and rigorous quality control.

Need a Custom PCB Solution? IOur engineering team can provide expert design for assembly (DFA) support to optimize your PCB layout before production.

Manufacturing Assembly

Panelized Board Size

Due to our advanced operational capacity and nearly limitless flexibility, we can assemble more PCBs faster than anyone else in the industry.

Board Details	Standard	Advanced
Board Size	.25″ x .25″ minimum size, panelized	17″ x 21″

Processes

Our assembly facility utilizes the latest technology and equipment, and we always keep tabs on industry trends and customer demand to make sure our capabilities meet your PCBA needs.

Assembly Processes	Standard	Advanced
3, 5, and 10-Day Turns	Yes	Yes
Single-Sided SMT	Yes	Yes
Double-Sided SMT	Yes	Yes
Through Hole	Yes	Yes
No Clean	Yes	Yes
Clean / Wash	Yes	Yes
ROHS and Leaded	Yes	Yes

Additional Assembly Processes	Standard	Advanced
Press Fits	Yes	Yes
Box Build	Yes	Yes
Fine Pitch to 08 Mils	.08 Mils	.04 Mils
BGA Repair and Reball	Yes	Yes
Part Removal and Replacement	Yes	Yes
Underfill	No	Yes
Staking	No	Yes
Conformal Coating	No	Yes
Fencing and Shields	No	Yes

Components

We provide full turnkey PCB assembly and manufacturing to help our customers across the country complete their projects on time. Our close and authentic partnerships with the most reputable US-based component and board suppliers is at the heart of the process. Test

Components	Standard	Advanced
SOIC	Yes	Yes
QFP	Yes	Yes
TQFN	Yes	Yes
Leadless	Yes	Yes
Through Hole	Yes	Yes
LGA	Yes	Yes
Passives	Down to 0201	Down to 01005
BGAs, uBGA, and VFBGA	Yes	Yes
Leadless Chip Carriers/ CSP	Yes	Yes
Microelescronics	Yes	Yes
Package-on-Package	Yes	Yes
Flip Chips	Yes	Yes
Hardware	No	Yes

Component Packaging	Standard	Advanced
Cut Tape	Yes	Yes
Loose Parts	Yes	Yes
Reels	Yes	Yes

Soldering Types & Methods

Soldering is one of the most basic techniques to understand for PCB assembly. Serving as a connective and conductive glue, a solid solder brings continuity and functionality to any circuit board.

Soldering Options	Standard	Advanced
Jet Paste Printing	Yes	Yes
Stencil/Water Soluble Paste	No	Yes
Vapor Phase Reflow	No	Yes
Conventional Reflow	Yes	Yes
Wave Solder / Selective Solder	Yes	Yes
Programmable Selective Solder	No	Yes

Inspection & Testing

Inspection is a critical part of the PCB assembly process. Without it, electronics manufacturers would never know for sure whether the PCB—and therefore the device—would work properly.

Inspection Processes	Standard	Advanced
Flying Probe	No	Yes
3D BGA X-Ray	Yes	Yes
Functional Testing	No	Yes
In-Line AOI	Yes	Yes
Visual Inspection	Yes	Yes
Component Inspection	Yes	Yes
Component Value Check	Yes	Yes
Ionic Contamination Test	No	Yes

Quality Standards

Following quality standards ensures all aspects of a PCB design are correctly implemented and the end products perform exactly as expected.

Quality Standards	Standard	Advanced
AS9100D	Yes	Yes
AS9102 FAIR	No	Yes
IPC Class II	Yes	Yes
IPC Class III	No	Yes
ITAR Certified	Yes	Yes
RoHS Compliant	Yes	Yes

Depanelization Methods

Once the boards are assembled and tested, they will need to be separated into their individual parts. There are many methods of depaneling PCBs, and which one you use depends on the type of panelization you chose.

Depanelization Methods	Standard	Advanced
V-Score	Yes	Yes
Mouse Bites	Yes	Yes
Mechanical Routing	No	Yes

Manufacturing Capabilities Overview

Download Summit’s Capabilities

FAQ

Frequently Asked Questions:

Summit can fabricate PCBs ranging from simple 2-layer boards to highly complex designs with 30+ layers as standard, and emerging capabilities extend beyond 44 layers.
Standard maximum panel size is 18″ x 24″, with advanced capabilities up to 21″ x 24″ and emerging capabilities reaching 24″ x 36″.
Yes, Summit offers HDI layers and sequential laminations from 2-3 up to 7 layers as permitted by laminate type.
Summit specializes in advanced PCB technologies including laser micro vias, blind vias, buried vias, and via-in-pad, with options for non-conductive, conductive epoxy, and copper-filled vias.
Summit offers HASL (leaded and lead-free), White Tin, ENEPIG, ENIG, Immersion Silver, and Entek Plus HT/OSP finishes for both standard and advanced applications.
Yes, Summit provides full turnkey PCB assembly including single and double-sided SMT, through-hole assembly, BGA placement, and additional services like box build, conformal coating, and functional testing.
Summit Interconnect maintains comprehensive quality certifications including AS9100D, IPC Class II and III, ITAR registration, and RoHS compliance. Certifications vary by facility based on specialized capabilities.

View our certifications by facility or contact us to match your project with the right certified location.
For inner layers with 1/2 oz. copper, Summit can achieve .003″/.003″ trace width/spacing in advanced capabilities, with emerging capabilities below .0025″/.002″.