WEBINAR: Best Practices for HDI and Sub-Lamination Structures

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High-density interconnect (HDI) and sub-lamination PCBs provide enhanced functionality and compact designs. In this webinar, industry veteran Gerry Partida, Summit’s Vice President of Technology, discusses important design best practices for HDI and sub-lamination structures.

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30 Oct

Oct 30, 2025 11:00 AM PT

REGISTER: Designing for Space: Understanding the IPC-6012 Space Addendum

Designing PCBs for aerospace and space applications means engineering for the harshest environments imaginable — vacuum, radiation, thermal extremes, vibration, and shock. Failure is not an option, and the standards reflect that reality.…

25 Sept

Sep 25, 2025 11:00 AM PT

RECORDING: IPC Standards for Quick-Turn, Prototype PCB Assembly

This webinar provides engineers and PCB designers with practical insights into how IPC standards directly impact the speed, quality, and reliability of prototype PCB builds. Attendees will learn which IPC standards are most…

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