Irvine, CA – February 20, 2025 – Summit Interconnect, a leading provider of advanced printed circuit board (PCB) solutions, is pleased to announce that Leo LaCroix has joined the company as Vice President of Aerospace & Defense Operations. In this role, LaCroix will oversee operational strategy, customer engagement, and manufacturing excellence for Summit’s aerospace and defense-focused facilities, driving continued growth and innovation in the sector.

LaCroix brings more than 25 years of leadership experience in complex manufacturing environments, with deep expertise in PCB technologies, operations management, and supply chain optimization. He has successfully led multi-facility teams across North America and Asia, spearheading initiatives in lean manufacturing, process improvement, and advanced technology development.

“Leo’s extensive experience in PCB manufacturing, coupled with his proven ability to drive operational excellence, makes him a tremendous addition to the leadership team at Summit Interconnect,” said Shane Whiteside, CEO of Summit Interconnect. “As we continue to strengthen our partnerships within the A&D industry, his leadership will be instrumental in enhancing our capabilities and delivering outstanding value to our customers.”

Prior to joining Summit Interconnect, LaCroix served as Executive Vice President of the Circuits Division at Firan Technology Group, where he was instrumental in integrating and optimizing the company’s U.S.-based facilities. His leadership resulted in significant revenue growth, operational efficiencies, and strategic positioning within the aerospace and defense sector. He also held senior leadership roles at Sanmina Corporation and Viasystems, where he was instrumental in driving profitability, securing major defense contracts, and advancing PCB manufacturing capabilities.

LaCroix expressed his enthusiasm for joining Summit Interconnect, stating: “I am excited to be part of a company that is committed to innovation and excellence in PCB manufacturing. Summit Interconnect has a strong reputation for best-in-class solutions, and I look forward to working with this outstanding team to drive continuous process improvements, expand our technological capabilities, and exceed our customers’ expectations.”

LaCroix holds a Bachelor’s degree in International Economy and Policy Studies from the University of Wisconsin–Madison with a concentration in International Business and multiple professional certifications in supply and operations management, including a Lean Six Sigma Black Belt.

For more information about Summit Interconnect and its industry-leading PCB solutions, please visit www.summitinterconnect.com.

Automotive electronics have become increasingly sophisticated, requiring high-reliability PCBs that can withstand extreme temperatures, vibrations, and environmental conditions. Automotive PCB manufacturing focuses on producing durable, high-performance circuit boards essential for modern vehicles and transportation infrastructures.

Key Considerations in Automotive PCB Manufacturing

Automotive PCBs must function in extreme heat, cold, and humidity. To achieve this, manufacturers use high-Tg (glass transition temperature) materials for improved heat resistance.  Enhanced thermal dissipation, while conformal coatings protect against moisture, dust, and chemicals, ensuring longevity in harsh environments.

Vehicles are subject to constant motion and impact, which makes vibration resistance crucial. Reinforced solder joints help prevent cracking under stress, while flexible PCBs are commonly used in areas requiring bending or movement. High-reliability interconnects ensure secure component attachment, maintaining consistent performance over time.

Safety and reliability standards are paramount in automotive PCB manufacturing. Compliance with ISO 26262 ensures functional safety in road vehicles, while IATF 16949 establishes a quality management system for automotive production. Components also undergo rigorous testing under AEC-Q100/AEC-Q200 standards to guarantee reliability in demanding automotive applications.

Different vehicle systems require specialized PCBs designed for specific functionalities. Engine Control Units (ECUs) rely on high-temperature, multi-layer boards for processing engine operations. Advanced Driver Assistance Systems (ADAS) demand high-frequency, low-loss PCBs for precise signal transmission. Electric Vehicle (EV) power management systems use heavy copper PCBs to handle efficient power distribution, while lighting and infotainment systems benefit from flexible and rigid-flex PCBs for compact designs.

To ensure automotive PCBs meet performance requirements, manufacturers implement advanced testing and quality control measures. Automated Optical Inspection (AOI) detects potential defects early in the process and X-ray testing analyzes hidden solder joints. Thermal cycling tests simulate real-world vehicle conditions, and high-voltage and electrical continuity tests verify the safety and performance of power systems.

Final Thoughts

Automotive PCB manufacturing demands high-quality materials, precision engineering, and strict compliance with safety regulations. As vehicles integrate more electronic features, advanced PCB technologies will continue to drive innovation in the automotive industry.