At the IPC APEX EXPO 2025, Mike Trammell of Summit Interconnect joined Mitchell Benson to discuss the future of PCB technology. Their conversation covered the latest advancements in PCB manufacturing, the push for miniaturization, and the increasing role of automation in the industry.

Breaking Micron Barriers with Advanced Materials

Summit Interconnect is leading the charge in high-density PCB manufacturing by pushing past traditional limitations.

Most manufacturers stop at 75-micron line and space dimensions, but Summit is currently operating at 40 microns and working towards achieving 30 microns. This miniaturization is critical for industries requiring ultra-high-density interconnects (HDI), including aerospace, defense, and next-gen consumer electronics.

To reach these new milestones, Summit is investing in advanced materials such as new dry films, high-performance laminates, and innovative substrates.

Next-Level Automation and Precision Engineering

Summit’s commitment to automation is revolutionizing PCB manufacturing. The company has implemented advanced imaging systems capable of imaging down to 18 microns, with plans for further refinements.

Key investments include:

• Automated direct imaging systems for superior precision.
• Advanced etching systems across multiple facilities.
• Fully automated production lines integrating robotics, AI algorithms, and Industry 4.0 solutions.

Summit expects new automation to be operational within the next three months, demonstrating the rapid pace at which the company is embracing automation.

The Role of Young Engineers in the Industry’s Future

A crucial part of Summit’s success lies in attracting and developing young engineering talent. Trammell emphasized the importance of bringing in fresh minds, mentoring them, and integrating them into the company’s cutting-edge engineering culture.

Summit’s internal training program, combined with IPC’s educational initiatives, helps groom young professionals not just in engineering but in the company’s culture and innovation mindset.

A Call to Action for Future Engineers

The conversation concluded with a strong message for young professionals considering a career in the PCB industry.

Trammell reassured them: “You’ll never be out of work. You’ll never be bored. The days will go by fast.”

For those who love hands-on problem-solving and want to work with cutting-edge technology, the PCB industry offers limitless opportunities.

Summit Interconnect: Leading the Way

With continued investments in advanced materials, miniaturization, and full automation, Summit Interconnect is paving the way for the future of PCB manufacturing.

As the company pushes past current limitations, it’s clear that Summit’s innovations will continue shaping the industry for years to come.

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Sean Patterson Named Chief Technology Officer, Michael Norman Joins
as President and Chief Operating Officer

March 6, Irvine, CA – Summit Interconnect, a leading provider of advanced PCB manufacturing solutions, is pleased to announce two key leadership updates to its executive team.

First, Summit Interconnect has strategically expanded its leadership by creating the role of Chief Technology Officer (CTO). This key position will be filled by Sean Patterson, the current Chief Operating Officer. As CTO, Patterson will lead Summit’s forward-looking technology vision, ensuring alignment with corporate goals and keeping the organization at the forefront of industry trends. He will oversee research and development, implement emerging technologies, and improve technical operations to make processes more efficient and cost-effective. His focus will also include using the latest technology advancements to enhance product quality and improve the customer experience.

Sean Patterson’s experience leading operations at Summit Interconnect, Nano Dimension, and Amazon makes him well-suited for the role of Chief Technology Officer. “As the pace of innovation accelerates, leadership in emerging technologies such as artificial intelligence and the Internet of Things will be critical to maintaining a competitive edge,” said Shane Whiteside, CEO of Summit Interconnect. “With Sean leading our technology initiatives as CTO, Summit will be well positioned for sustained success in an increasingly digital and interconnected world.”

Second, Summit is pleased to welcome Michael Norman to the team as its new President and Chief Operating Officer. With over 30 years of leadership experience in aerospace, defense, and technology, Norman brings a strong track record of managing complex operations and delivering high-performance solutions.

Norman joins Summit from Raytheon, where he served as Vice President of Space, Imaging, and Microelectronics, overseeing multiple subsidiaries focused on focal plane arrays/imagers, high-reliability electronics for satellite systems, and advanced semiconductor microelectronics. His prior leadership roles at L3Harris and Lockheed Martin further highlight his ability to successfully lead large-scale programs, improve operational efficiencies, and expand market reach.

“I am excited to join Summit and strengthen its leadership in the PCB industry at a critical time for U.S. manufacturing,” said Michael Norman, President and COO. “Summit’s commitment to high-reliability circuit boards for aerospace, defense, and commercial industries is impressive. I look forward to working with this talented team to meet our customers’ evolving technology needs.”

Norman will oversee all North American operations, sales, and marketing to drive strategic growth and operational excellence across the organization. Shane Whiteside will continue to lead Summit Interconnect as Chief Executive Officer and Chairman of the Board.