The European Chemicals Agency (ECHA) is proposing a broad ban on perfluoroalkyl and polyfluoroalkyl substances (PFAS) and PFAS-containing products in the European Union (EU). This impending regulation could impact to the electronics manufacturing industry. To effectively advocate for the industry’s interests and secure exemptions during the policymaking window this summer, IPC, on behalf of its member-led Environment and Health Strategic Management Team, is asking for electronic and chemical manufacturers to fill out a survey, providing information on their use of PFAS. Fill out the survey.

The Impact of the PFAS Ban

PFAS are widely used in consumer, commercial, and industrial processes, and electronics manufacturers utilize them for their insulating properties, thermal resistance, low surface tension, and chemical resistance. However, due to concerns about their toxicity and persistence in the environment, the EU may ban thousands of PFAS, potentially disrupting the supply chain and electronics production.

The Need for Data

IPC needs data from manufacturers to provide policymakers with information on PFAS uses and recommended exemptions from the ban.

The ECHA Questionnaire

IPC is specifically looking for detailed data related to Question 6 from the ECHA questionnaire. This section focuses on missing uses of PFAS and requires information on key functionalities, affected companies, availability and feasibility of alternatives, R&D initiatives, substitution challenges, and potential socio-economic impacts.

Collaborative Effort

IPC is urging electronics manufacturers to collaborate with their supply chain partners to gather relevant data and insights on PFAS usage. By working together, the industry can present a comprehensive view, which may increase the likelihood of securing exemptions for crucial PFAS applications.

Next Steps

The deadline for providing information to ECHA is September 25, 2023. However, IPC is encouraging early submissions and is asking for completion of its questionnaire by Friday, August 4. Companies can either submit information directly to ECHA or share it with IPC.

Conclusion

To protect the electronics manufacturing industry’s interests, it is important that companies contribute detailed data and information to IPC during the consultation period. Together, we can make a strong case for the essential uses of PFAS and work towards securing exemptions that will protect the industry and the environment.

Additional Resources

IPC offers the following resources:

• OECD Global Database on Per and Poly Fluorinated Chemicals
• PFAS in Electronics Datasheet
• Presentation on Potential PFAS Uses in Electronics
• Trade Names Document
• Survey

June 28, 2023, Anaheim, CA – Summit Interconnect today announced the appointment of Brian Kamradt as chief financial officer. Kamradt brings over 20 years of finance, accounting, merger and acquisition, and IT experience to Summit’s leadership team. He will succeed Tom Caldwell, Summit’s initial CFO, who will be retiring after leading the company’s expansion for the past four years.

“Tom played a critical role in Summit’s development, and I wish to sincerely thank him for the significant contributions he’s made to our company,” said Shane Whiteside, CEO of Summit Interconnect. “He is a highly valued and respected colleague.”

Kamradt is a solutions-focused finance leader with proven success in leveraging technology to create scalable service operations. Most recently, as CFO and Head of IT at Jonathan Engineered Solutions, he was directly involved in multiple strategic acquisitions and expanding the use of technology in decision-making. Kamradt also gained significant manufacturing and international finance experience while serving as CFO for Nortek Security, VP of Finance at Curtiss-Wright Corporation, and VP of Finance for Meggitt/Parker.

“Brian clearly has extensive experience managing global financial operations,” said Whiteside. “He also has a track record of implementing transformative business processes that will help accelerate our business initiatives and advance Summit’s industry leadership position. We are pleased to have him on our team.”

Kamradt joins Summit Interconnect at a pivotal time in the printed circuit board (PCB) industry’s evolution. Challenges to supply chains, a tight labor market, and a renewed focus on regional manufacturing has prompted the introduction of government legislation aimed at increasing the production of PCBs in North America.

“I am honored to be joining Summit and am inspired by the company’s vision and purpose,” said Brian Kamradt, CFO at Summit. “Summit’s powerful combination of people, products, and technology is unmatched in the industry. I look forward to working with all the teams to further accelerate growth and create even greater value for our customers and stakeholders.”

Kamradt holds a Master’s in Business Administration from ESADE in Barcelona, Spain, and a Bachelor of Arts in Economics and International Management from Hamline University, St. Paul, Minnesota. He is fluent in English, Spanish, and Catalan.

About Summit Interconnect: Summit Interconnect is the largest, privately held PCB manufacturer in North America. The company is focused on the fast-growing defense and high-performance commercial sectors in the North American market.  Summit offers solutions ranging from advanced cutting-edge prototyping to complex high mix, low-to-mid volume production.  Summit’s eight facilities are located across California, Illinois, Colorado, and Toronto, Canada. For more information, please visit  summitinterconnect.com.

Media Contact: Lisa Holmes, Director of Marketing, Summit Interconnect, 303-307-9909, lisa.holmes@summitinterconnect.com.