{"id":11380,"date":"2021-01-27T17:53:19","date_gmt":"2021-01-27T17:53:19","guid":{"rendered":"https:\/\/summitinterconnect.ca\/blog\/article\/plaidoyer-en-faveur-dun-boitier-bga-cga-de-11-mm\/"},"modified":"2025-12-17T10:49:26","modified_gmt":"2025-12-17T10:49:26","slug":"the-case-for-a-1-1mm-bga-cga-package","status":"publish","type":"post","link":"https:\/\/summitinterconnect.ca\/fr\/blog\/article\/the-case-for-a-1-1mm-bga-cga-package\/","title":{"rendered":"Plaidoyer en faveur d'un bo\u00eetier BGA\/CGA de 1,1 mm"},"content":{"rendered":"<h3>Une nouvelle approche pour am\u00e9liorer les performances des PCB, garantir la conformit\u00e9, r\u00e9duire le temps de conception et de fabrication, augmenter les rendements et minimiser les d\u00e9faillances sur le terrain.<\/h3><figure class=\"img-caption\"><img decoding=\"async\" loading=\"lazy\" class=\"img-caption__img\" src=\"https:\/\/summitinterconnect.com\/wp-content\/uploads\/2023\/01\/1.1-mm-Image-A.jpg\" alt=\"\"><\/figure><p>Comme la plupart d'entre vous le savent, il n'existe pas de bo\u00eetier BGA ou CGA de 1,1 mm. Cet article a pour but de partager mes r\u00e9flexions sur les compromis auxquels nous sommes confront\u00e9s aujourd'hui, car nous sommes contraints d'utiliser un pas de 1 mm, et sur la mani\u00e8re dont une l\u00e9g\u00e8re augmentation de la taille du pas pourrait satisfaire les besoins des conceptions actuelles \u00e0 nombre \u00e9lev\u00e9 de broches d'E\/S. Cet article est issu de mes observations lors de la construction de produits de classe 3 et de pas de 1 mm pour mes clients, ainsi que des d\u00e9fis, des revers, des reconceptions, des produits retourn\u00e9s et des pannes sur le terrain que nous subissons tous.  <\/p>\n<p>Id\u00e9alement, nous aimerions tous avoir les allocations suivantes dans une conception en termes de performance, de disposition, de conformit\u00e9 et de rendement.<\/p>\n<ul>\n<li>La possibilit\u00e9 de doubler les conducteurs de voie entre les vias.<\/li>\n<li>Conducteurs dont la section n'est pas inf\u00e9rieure \u00e0 0,004\"<\/li>\n<li>Espacement entre les conducteurs non inf\u00e9rieur \u00e0 0,004\"<\/li>\n<li>Distance entre le foret et le cuivre de 0,010\"<\/li>\n<li>Diam\u00e8tres de per\u00e7age de 0,010\" et rapports d'aspect inf\u00e9rieurs \u00e0 12:1.<\/li>\n<li>Bague annulaire conforme \u00e0 la classe 3 (la conception doit avoir une surface de 0,014\" au-dessus du foret)<br \/>\n taille)<\/li>\n<li>Respecter le placage de cuivre dans le trou .001\" minimum (IPC-6012 classe 3)<\/li>\n<li>Si via dans le tampon, remplissage \u00e9poxy conforme \u00e0 la norme IPC-6012<\/li>\n<li>Une conception capable de passer les tests OM Reflow 2.6.8 et Thermal Shock 2.6.27B avec un taux de r\u00e9ussite proche de 100 %.<\/li>\n<\/ul>\n<p>Actuellement, le pas de 1 mm ne le permet pas et nous entrons dans un monde de compromis et de r\u00e9sultats de non-conformit\u00e9 plus \u00e9lev\u00e9s. Voyons quels sont les compromis par rapport \u00e0 la classe 3 de l'IPC-6012. Veuillez garder \u00e0 l'esprit que pour ces constructions complexes avec plusieurs cycles de lamination, la perte d'un panneau peut \u00eatre de 1 000 \u00e0 10 000 dollars, voire plus.  <\/p><figure class=\"img-caption\"><img decoding=\"async\" loading=\"lazy\" class=\"img-caption__img\" src=\"https:\/\/summitinterconnect.com\/wp-content\/uploads\/2023\/01\/1.1-mm-Image-B.jpg\" alt=\"\"><\/figure>","protected":false},"excerpt":{"rendered":"<p>Une nouvelle approche pour am\u00e9liorer les performances des PCB, garantir la conformit\u00e9, r\u00e9duire le temps de conception et de fabrication, augmenter les rendements et minimiser les d\u00e9faillances sur le terrain. Comme la plupart d'entre vous le savent, il n'existe pas de bo\u00eetier BGA ou CGA de 1,1 mm. Cet article a pour but de partager [&hellip;]<\/p>\n","protected":false},"author":3,"featured_media":0,"comment_status":"closed","ping_status":"closed","sticky":false,"template":"","format":"standard","meta":{"_acf_changed":false,"content-type":"","footnotes":""},"categories":[75],"tags":[],"class_list":["post-11380","post","type-post","status-publish","format-standard","hentry","category-non-categorise"],"acf":[],"yoast_head":"<!-- This site is optimized with the Yoast SEO plugin v27.4 - https:\/\/yoast.com\/product\/yoast-seo-wordpress\/ -->\n<title>Plaidoyer en faveur d&#039;un bo\u00eetier BGA\/CGA de 1,1 mm - Summit Interconnect CA<\/title>\n<meta name=\"description\" content=\"Summit Interconnect, une soci\u00e9t\u00e9 de fabrication de circuits imprim\u00e9s, explique les bo\u00eetiers BGA\/CGA 1:1 mm dans les processus de fabrication de circuits imprim\u00e9s Quick Turn.\" \/>\n<meta name=\"robots\" content=\"index, follow, max-snippet:-1, max-image-preview:large, max-video-preview:-1\" \/>\n<link rel=\"canonical\" href=\"https:\/\/summitinterconnect.ca\/fr\/blog\/article\/the-case-for-a-1-1mm-bga-cga-package\/\" \/>\n<meta property=\"og:locale\" content=\"fr_FR\" \/>\n<meta property=\"og:type\" content=\"article\" \/>\n<meta property=\"og:title\" content=\"Plaidoyer en faveur d&#039;un bo\u00eetier BGA\/CGA de 1,1 mm - Summit Interconnect CA\" \/>\n<meta property=\"og:description\" content=\"Summit Interconnect, une soci\u00e9t\u00e9 de fabrication de circuits imprim\u00e9s, explique les bo\u00eetiers BGA\/CGA 1:1 mm dans les processus de fabrication de circuits imprim\u00e9s Quick Turn.\" \/>\n<meta property=\"og:url\" content=\"https:\/\/summitinterconnect.ca\/fr\/blog\/article\/the-case-for-a-1-1mm-bga-cga-package\/\" \/>\n<meta property=\"og:site_name\" content=\"Summit Interconnect CA\" \/>\n<meta property=\"article:published_time\" content=\"2021-01-27T17:53:19+00:00\" \/>\n<meta property=\"article:modified_time\" content=\"2025-12-17T10:49:26+00:00\" \/>\n<meta property=\"og:image\" content=\"https:\/\/summitinterconnect.com\/wp-content\/uploads\/2023\/01\/1.1-mm-Image-A.jpg\" \/>\n<meta name=\"author\" content=\"Lisa Holmes\" \/>\n<meta name=\"twitter:card\" content=\"summary_large_image\" \/>\n<meta name=\"twitter:label1\" content=\"Written by\" \/>\n\t<meta name=\"twitter:data1\" content=\"Lisa Holmes\" \/>\n<script type=\"application\/ld+json\" class=\"yoast-schema-graph\">{\"@context\":\"https:\\\/\\\/schema.org\",\"@graph\":[{\"@type\":\"Article\",\"@id\":\"https:\\\/\\\/summitinterconnect.ca\\\/fr\\\/blog\\\/article\\\/the-case-for-a-1-1mm-bga-cga-package\\\/#article\",\"isPartOf\":{\"@id\":\"https:\\\/\\\/summitinterconnect.ca\\\/fr\\\/blog\\\/article\\\/the-case-for-a-1-1mm-bga-cga-package\\\/\"},\"author\":{\"name\":\"Lisa Holmes\",\"@id\":\"https:\\\/\\\/summitinterconnect.ca\\\/fr\\\/#\\\/schema\\\/person\\\/8161b443deae10987581fa71a3ca1b3c\"},\"headline\":\"Plaidoyer en faveur d'un bo\u00eetier BGA\\\/CGA de 1,1 mm\",\"datePublished\":\"2021-01-27T17:53:19+00:00\",\"dateModified\":\"2025-12-17T10:49:26+00:00\",\"mainEntityOfPage\":{\"@id\":\"https:\\\/\\\/summitinterconnect.ca\\\/fr\\\/blog\\\/article\\\/the-case-for-a-1-1mm-bga-cga-package\\\/\"},\"wordCount\":362,\"image\":{\"@id\":\"https:\\\/\\\/summitinterconnect.ca\\\/fr\\\/blog\\\/article\\\/the-case-for-a-1-1mm-bga-cga-package\\\/#primaryimage\"},\"thumbnailUrl\":\"https:\\\/\\\/summitinterconnect.com\\\/wp-content\\\/uploads\\\/2023\\\/01\\\/1.1-mm-Image-A.jpg\",\"articleSection\":[\"Non cat\u00e9goris\u00e9\"],\"inLanguage\":\"fr-FR\"},{\"@type\":\"WebPage\",\"@id\":\"https:\\\/\\\/summitinterconnect.ca\\\/fr\\\/blog\\\/article\\\/the-case-for-a-1-1mm-bga-cga-package\\\/\",\"url\":\"https:\\\/\\\/summitinterconnect.ca\\\/fr\\\/blog\\\/article\\\/the-case-for-a-1-1mm-bga-cga-package\\\/\",\"name\":\"Plaidoyer en faveur d'un bo\u00eetier BGA\\\/CGA de 1,1 mm - Summit Interconnect CA\",\"isPartOf\":{\"@id\":\"https:\\\/\\\/summitinterconnect.ca\\\/fr\\\/#website\"},\"primaryImageOfPage\":{\"@id\":\"https:\\\/\\\/summitinterconnect.ca\\\/fr\\\/blog\\\/article\\\/the-case-for-a-1-1mm-bga-cga-package\\\/#primaryimage\"},\"image\":{\"@id\":\"https:\\\/\\\/summitinterconnect.ca\\\/fr\\\/blog\\\/article\\\/the-case-for-a-1-1mm-bga-cga-package\\\/#primaryimage\"},\"thumbnailUrl\":\"https:\\\/\\\/summitinterconnect.com\\\/wp-content\\\/uploads\\\/2023\\\/01\\\/1.1-mm-Image-A.jpg\",\"datePublished\":\"2021-01-27T17:53:19+00:00\",\"dateModified\":\"2025-12-17T10:49:26+00:00\",\"author\":{\"@id\":\"https:\\\/\\\/summitinterconnect.ca\\\/fr\\\/#\\\/schema\\\/person\\\/8161b443deae10987581fa71a3ca1b3c\"},\"description\":\"Summit Interconnect, une soci\u00e9t\u00e9 de fabrication de circuits imprim\u00e9s, explique les bo\u00eetiers BGA\\\/CGA 1:1 mm dans les processus de fabrication de circuits imprim\u00e9s Quick Turn.\",\"breadcrumb\":{\"@id\":\"https:\\\/\\\/summitinterconnect.ca\\\/fr\\\/blog\\\/article\\\/the-case-for-a-1-1mm-bga-cga-package\\\/#breadcrumb\"},\"inLanguage\":\"fr-FR\",\"potentialAction\":[{\"@type\":\"ReadAction\",\"target\":[\"https:\\\/\\\/summitinterconnect.ca\\\/fr\\\/blog\\\/article\\\/the-case-for-a-1-1mm-bga-cga-package\\\/\"]}]},{\"@type\":\"ImageObject\",\"inLanguage\":\"fr-FR\",\"@id\":\"https:\\\/\\\/summitinterconnect.ca\\\/fr\\\/blog\\\/article\\\/the-case-for-a-1-1mm-bga-cga-package\\\/#primaryimage\",\"url\":\"https:\\\/\\\/summitinterconnect.com\\\/wp-content\\\/uploads\\\/2023\\\/01\\\/1.1-mm-Image-A.jpg\",\"contentUrl\":\"https:\\\/\\\/summitinterconnect.com\\\/wp-content\\\/uploads\\\/2023\\\/01\\\/1.1-mm-Image-A.jpg\"},{\"@type\":\"BreadcrumbList\",\"@id\":\"https:\\\/\\\/summitinterconnect.ca\\\/fr\\\/blog\\\/article\\\/the-case-for-a-1-1mm-bga-cga-package\\\/#breadcrumb\",\"itemListElement\":[{\"@type\":\"ListItem\",\"position\":1,\"name\":\"Home\",\"item\":\"https:\\\/\\\/summitinterconnect.ca\\\/fr\\\/\"},{\"@type\":\"ListItem\",\"position\":2,\"name\":\"Plaidoyer en faveur d&#8217;un bo\u00eetier BGA\\\/CGA de 1,1 mm\"}]},{\"@type\":\"WebSite\",\"@id\":\"https:\\\/\\\/summitinterconnect.ca\\\/fr\\\/#website\",\"url\":\"https:\\\/\\\/summitinterconnect.ca\\\/fr\\\/\",\"name\":\"Summit Interconnect CA\",\"description\":\"\",\"potentialAction\":[{\"@type\":\"SearchAction\",\"target\":{\"@type\":\"EntryPoint\",\"urlTemplate\":\"https:\\\/\\\/summitinterconnect.ca\\\/fr\\\/?s={search_term_string}\"},\"query-input\":{\"@type\":\"PropertyValueSpecification\",\"valueRequired\":true,\"valueName\":\"search_term_string\"}}],\"inLanguage\":\"fr-FR\"},{\"@type\":\"Person\",\"@id\":\"https:\\\/\\\/summitinterconnect.ca\\\/fr\\\/#\\\/schema\\\/person\\\/8161b443deae10987581fa71a3ca1b3c\",\"name\":\"Lisa Holmes\",\"image\":{\"@type\":\"ImageObject\",\"inLanguage\":\"fr-FR\",\"@id\":\"https:\\\/\\\/secure.gravatar.com\\\/avatar\\\/969dc310dce0b3b4a5486c29ded8515db51a0e68326cca382732ebc27b4256a1?s=96&d=mm&r=g\",\"url\":\"https:\\\/\\\/secure.gravatar.com\\\/avatar\\\/969dc310dce0b3b4a5486c29ded8515db51a0e68326cca382732ebc27b4256a1?s=96&d=mm&r=g\",\"contentUrl\":\"https:\\\/\\\/secure.gravatar.com\\\/avatar\\\/969dc310dce0b3b4a5486c29ded8515db51a0e68326cca382732ebc27b4256a1?s=96&d=mm&r=g\",\"caption\":\"Lisa Holmes\"},\"url\":\"https:\\\/\\\/summitinterconnect.ca\\\/fr\\\/blog\\\/article\\\/author\\\/lisa\\\/\"}]}<\/script>\n<!-- \/ Yoast SEO plugin. -->","yoast_head_json":{"title":"Plaidoyer en faveur d'un bo\u00eetier BGA\/CGA de 1,1 mm - Summit Interconnect CA","description":"Summit Interconnect, une soci\u00e9t\u00e9 de fabrication de circuits imprim\u00e9s, explique les bo\u00eetiers BGA\/CGA 1:1 mm dans les processus de fabrication de circuits imprim\u00e9s Quick Turn.","robots":{"index":"index","follow":"follow","max-snippet":"max-snippet:-1","max-image-preview":"max-image-preview:large","max-video-preview":"max-video-preview:-1"},"canonical":"https:\/\/summitinterconnect.ca\/fr\/blog\/article\/the-case-for-a-1-1mm-bga-cga-package\/","og_locale":"fr_FR","og_type":"article","og_title":"Plaidoyer en faveur d'un bo\u00eetier BGA\/CGA de 1,1 mm - Summit Interconnect CA","og_description":"Summit Interconnect, une soci\u00e9t\u00e9 de fabrication de circuits imprim\u00e9s, explique les bo\u00eetiers BGA\/CGA 1:1 mm dans les processus de fabrication de circuits imprim\u00e9s Quick Turn.","og_url":"https:\/\/summitinterconnect.ca\/fr\/blog\/article\/the-case-for-a-1-1mm-bga-cga-package\/","og_site_name":"Summit Interconnect CA","article_published_time":"2021-01-27T17:53:19+00:00","article_modified_time":"2025-12-17T10:49:26+00:00","og_image":[{"url":"https:\/\/summitinterconnect.com\/wp-content\/uploads\/2023\/01\/1.1-mm-Image-A.jpg","type":"","width":"","height":""}],"author":"Lisa Holmes","twitter_card":"summary_large_image","twitter_misc":{"Written by":"Lisa Holmes"},"schema":{"@context":"https:\/\/schema.org","@graph":[{"@type":"Article","@id":"https:\/\/summitinterconnect.ca\/fr\/blog\/article\/the-case-for-a-1-1mm-bga-cga-package\/#article","isPartOf":{"@id":"https:\/\/summitinterconnect.ca\/fr\/blog\/article\/the-case-for-a-1-1mm-bga-cga-package\/"},"author":{"name":"Lisa Holmes","@id":"https:\/\/summitinterconnect.ca\/fr\/#\/schema\/person\/8161b443deae10987581fa71a3ca1b3c"},"headline":"Plaidoyer en faveur d'un bo\u00eetier BGA\/CGA de 1,1 mm","datePublished":"2021-01-27T17:53:19+00:00","dateModified":"2025-12-17T10:49:26+00:00","mainEntityOfPage":{"@id":"https:\/\/summitinterconnect.ca\/fr\/blog\/article\/the-case-for-a-1-1mm-bga-cga-package\/"},"wordCount":362,"image":{"@id":"https:\/\/summitinterconnect.ca\/fr\/blog\/article\/the-case-for-a-1-1mm-bga-cga-package\/#primaryimage"},"thumbnailUrl":"https:\/\/summitinterconnect.com\/wp-content\/uploads\/2023\/01\/1.1-mm-Image-A.jpg","articleSection":["Non cat\u00e9goris\u00e9"],"inLanguage":"fr-FR"},{"@type":"WebPage","@id":"https:\/\/summitinterconnect.ca\/fr\/blog\/article\/the-case-for-a-1-1mm-bga-cga-package\/","url":"https:\/\/summitinterconnect.ca\/fr\/blog\/article\/the-case-for-a-1-1mm-bga-cga-package\/","name":"Plaidoyer en faveur d'un bo\u00eetier BGA\/CGA de 1,1 mm - Summit Interconnect CA","isPartOf":{"@id":"https:\/\/summitinterconnect.ca\/fr\/#website"},"primaryImageOfPage":{"@id":"https:\/\/summitinterconnect.ca\/fr\/blog\/article\/the-case-for-a-1-1mm-bga-cga-package\/#primaryimage"},"image":{"@id":"https:\/\/summitinterconnect.ca\/fr\/blog\/article\/the-case-for-a-1-1mm-bga-cga-package\/#primaryimage"},"thumbnailUrl":"https:\/\/summitinterconnect.com\/wp-content\/uploads\/2023\/01\/1.1-mm-Image-A.jpg","datePublished":"2021-01-27T17:53:19+00:00","dateModified":"2025-12-17T10:49:26+00:00","author":{"@id":"https:\/\/summitinterconnect.ca\/fr\/#\/schema\/person\/8161b443deae10987581fa71a3ca1b3c"},"description":"Summit Interconnect, une soci\u00e9t\u00e9 de fabrication de circuits imprim\u00e9s, explique les bo\u00eetiers BGA\/CGA 1:1 mm dans les processus de fabrication de circuits imprim\u00e9s Quick Turn.","breadcrumb":{"@id":"https:\/\/summitinterconnect.ca\/fr\/blog\/article\/the-case-for-a-1-1mm-bga-cga-package\/#breadcrumb"},"inLanguage":"fr-FR","potentialAction":[{"@type":"ReadAction","target":["https:\/\/summitinterconnect.ca\/fr\/blog\/article\/the-case-for-a-1-1mm-bga-cga-package\/"]}]},{"@type":"ImageObject","inLanguage":"fr-FR","@id":"https:\/\/summitinterconnect.ca\/fr\/blog\/article\/the-case-for-a-1-1mm-bga-cga-package\/#primaryimage","url":"https:\/\/summitinterconnect.com\/wp-content\/uploads\/2023\/01\/1.1-mm-Image-A.jpg","contentUrl":"https:\/\/summitinterconnect.com\/wp-content\/uploads\/2023\/01\/1.1-mm-Image-A.jpg"},{"@type":"BreadcrumbList","@id":"https:\/\/summitinterconnect.ca\/fr\/blog\/article\/the-case-for-a-1-1mm-bga-cga-package\/#breadcrumb","itemListElement":[{"@type":"ListItem","position":1,"name":"Home","item":"https:\/\/summitinterconnect.ca\/fr\/"},{"@type":"ListItem","position":2,"name":"Plaidoyer en faveur d&#8217;un bo\u00eetier BGA\/CGA de 1,1 mm"}]},{"@type":"WebSite","@id":"https:\/\/summitinterconnect.ca\/fr\/#website","url":"https:\/\/summitinterconnect.ca\/fr\/","name":"Summit Interconnect CA","description":"","potentialAction":[{"@type":"SearchAction","target":{"@type":"EntryPoint","urlTemplate":"https:\/\/summitinterconnect.ca\/fr\/?s={search_term_string}"},"query-input":{"@type":"PropertyValueSpecification","valueRequired":true,"valueName":"search_term_string"}}],"inLanguage":"fr-FR"},{"@type":"Person","@id":"https:\/\/summitinterconnect.ca\/fr\/#\/schema\/person\/8161b443deae10987581fa71a3ca1b3c","name":"Lisa Holmes","image":{"@type":"ImageObject","inLanguage":"fr-FR","@id":"https:\/\/secure.gravatar.com\/avatar\/969dc310dce0b3b4a5486c29ded8515db51a0e68326cca382732ebc27b4256a1?s=96&d=mm&r=g","url":"https:\/\/secure.gravatar.com\/avatar\/969dc310dce0b3b4a5486c29ded8515db51a0e68326cca382732ebc27b4256a1?s=96&d=mm&r=g","contentUrl":"https:\/\/secure.gravatar.com\/avatar\/969dc310dce0b3b4a5486c29ded8515db51a0e68326cca382732ebc27b4256a1?s=96&d=mm&r=g","caption":"Lisa Holmes"},"url":"https:\/\/summitinterconnect.ca\/fr\/blog\/article\/author\/lisa\/"}]}},"_links":{"self":[{"href":"https:\/\/summitinterconnect.ca\/fr\/wp-json\/wp\/v2\/posts\/11380","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/summitinterconnect.ca\/fr\/wp-json\/wp\/v2\/posts"}],"about":[{"href":"https:\/\/summitinterconnect.ca\/fr\/wp-json\/wp\/v2\/types\/post"}],"author":[{"embeddable":true,"href":"https:\/\/summitinterconnect.ca\/fr\/wp-json\/wp\/v2\/users\/3"}],"replies":[{"embeddable":true,"href":"https:\/\/summitinterconnect.ca\/fr\/wp-json\/wp\/v2\/comments?post=11380"}],"version-history":[{"count":3,"href":"https:\/\/summitinterconnect.ca\/fr\/wp-json\/wp\/v2\/posts\/11380\/revisions"}],"predecessor-version":[{"id":14044,"href":"https:\/\/summitinterconnect.ca\/fr\/wp-json\/wp\/v2\/posts\/11380\/revisions\/14044"}],"wp:attachment":[{"href":"https:\/\/summitinterconnect.ca\/fr\/wp-json\/wp\/v2\/media?parent=11380"}],"wp:term":[{"taxonomy":"category","embeddable":true,"href":"https:\/\/summitinterconnect.ca\/fr\/wp-json\/wp\/v2\/categories?post=11380"},{"taxonomy":"post_tag","embeddable":true,"href":"https:\/\/summitinterconnect.ca\/fr\/wp-json\/wp\/v2\/tags?post=11380"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}