{"id":11298,"date":"2020-11-24T18:34:21","date_gmt":"2020-11-24T18:34:21","guid":{"rendered":"https:\/\/summitinterconnect.ca\/blog\/article\/notions-de-base-sur-la-fabrication-de-circuits-imprimes-comment-sont-realisees-les-pistes\/"},"modified":"2025-12-17T10:48:57","modified_gmt":"2025-12-17T10:48:57","slug":"pcb-fabrication-basics-how-traces-are-made","status":"publish","type":"post","link":"https:\/\/summitinterconnect.ca\/fr\/blog\/article\/pcb-fabrication-basics-how-traces-are-made\/","title":{"rendered":"Notions de base sur la fabrication de circuits imprim\u00e9s : comment sont r\u00e9alis\u00e9es les pistes"},"content":{"rendered":"<h2>Progression de la Gravure<\/h2>\n<p>La feuille de cuivre **ne se grave pas \u00e0 angle droit** par rapport \u00e0 la surface du circuit imprim\u00e9.<br \/>\nDans un premier temps, seules les **surfaces expos\u00e9es du cuivre** r\u00e9agissent et sont \u00e9limin\u00e9es par l\u2019agent de gravure, dissolvant principalement **le mat\u00e9riau perpendiculairement \u00e0 la surface** de la carte.  <\/p>\n<p>Ensuite, \u00e0 mesure que l\u2019agent de gravure progresse **de la couche de r\u00e9sistant \u00e0 la gravure vers la couche de substrat**, l\u2019\u00e9limination du mat\u00e9riau **lat\u00e9ral** devient plus importante.<br \/>\nApr\u00e8s un certain temps dans les cuves de gravure, l\u2019agent liquide **\u00e9limine le cuivre \u00e0 la fois perpendiculairement et parall\u00e8lement \u00e0 la surface du circuit imprim\u00e9**.<\/p>\n<p>Aux **premi\u00e8res \u00e9tapes du processus de gravure**, les **coupes transversales des surfaces de cuivre non prot\u00e9g\u00e9es** apparaissent **circulaires**. Ensuite, elles deviennent **trap\u00e9zo\u00efdales avec des bords incurv\u00e9s** et, apr\u00e8s une gravure prolong\u00e9e, les **c\u00f4t\u00e9s peuvent sembler presque verticaux**.<\/p><figure class=\"img-caption\"><img decoding=\"async\" loading=\"lazy\" class=\"img-caption__img\" src=\"https:\/\/summitinterconnect.com\/wp-content\/uploads\/2022\/02\/etch-progression-rc.jpg\" alt=\"\"><\/figure><p>La progression de la courbe vers la verticale n\u00e9cessite plus de temps dans les cuves de gravure et l'\u00e9limination de quantit\u00e9s de cuivre sup\u00e9rieures \u00e0 la normale. Les fabricants ne gravent pas les traces au point de les rendre verticales, sauf si cela est sp\u00e9cifiquement demand\u00e9 par un concepteur de PCB. <\/p>\n<h2>Compensation de gravure du cuivre<\/h2>\n<p>Apr\u00e8s gravure, le cuivre le plus proche de la couche de r\u00e9serve de gravure est g\u00e9n\u00e9ralement plus \u00e9troit que celui le plus proche du substrat. Pour garantir une largeur de cuivre ad\u00e9quate apr\u00e8s gravure, les fabricants doivent ajuster le motif du cuivre avant la fabrication gr\u00e2ce \u00e0 un processus appel\u00e9 compensation de gravure. En fonction du poids du cuivre, les fabricants agrandissent les motifs de cuivre de 1 \u00e0 8 mils dans l'espace disponible, afin qu'apr\u00e8s gravure, la largeur de la trace atteigne un minimum sp\u00e9cifi\u00e9.  <\/p>\n<h2>R\u00e9duction et indemnisation du cuivre<\/h2>\n<p>Des \u00e9l\u00e9ments en cuivre tr\u00e8s serr\u00e9s peuvent interf\u00e9rer avec ce processus de compensation. Il doit y avoir suffisamment d'espace entre les \u00e9l\u00e9ments en cuivre pour permettre au produit de gravure de se d\u00e9placer librement dans une zone et aux atomes de cuivre de sortir. Pour permettre une compensation de gravure ad\u00e9quate sur les \u00e9l\u00e9ments critiques, les fabricants coupent parfois le cuivre des autres filets dans un processus de r\u00e9duction.  <\/p><p><img decoding=\"async\" class=\"alignnone size-full wp-image-8950\" src=\"https:\/\/summitinterconnect.ca\/wp-content\/uploads\/2020\/11\/Traces-Image.png\" alt=\"\" width=\"300\" height=\"88\"><\/p><figure class=\"img-caption\"><img decoding=\"async\" loading=\"lazy\" class=\"img-caption__img\" src=\"https:\/\/summitinterconnect.com\/wp-content\/uploads\/2022\/02\/traces-4.jpg\" alt=\"\"><\/figure><p>Il existe quelques d\u00e9tails suppl\u00e9mentaires sur le processus qui n'ont pas \u00e9t\u00e9 abord\u00e9s ici, tels que le remplissage via, les catalyseurs autocatalytiques, etc. Pour en savoir plus, contactez l'\u00e9quipe technologique de Summit. <\/p>","protected":false},"excerpt":{"rendered":"<p>Progression de la Gravure La feuille de cuivre **ne se grave pas \u00e0 angle droit** par rapport \u00e0 la surface du circuit imprim\u00e9. Dans un premier temps, seules les **surfaces expos\u00e9es du cuivre** r\u00e9agissent et sont \u00e9limin\u00e9es par l\u2019agent de gravure, dissolvant principalement **le mat\u00e9riau perpendiculairement \u00e0 la surface** de la carte. Ensuite, \u00e0 mesure [&hellip;]<\/p>\n","protected":false},"author":3,"featured_media":0,"comment_status":"closed","ping_status":"closed","sticky":false,"template":"","format":"standard","meta":{"_acf_changed":false,"content-type":"","footnotes":""},"categories":[86,84,87],"tags":[],"class_list":["post-11298","post","type-post","status-publish","format-standard","hentry","category-conception","category-fabrication-fr","category-theorie"],"acf":[],"yoast_head":"<!-- This site is optimized with the Yoast SEO plugin v27.2 - https:\/\/yoast.com\/product\/yoast-seo-wordpress\/ -->\n<title>Notions de base sur la fabrication de circuits imprim\u00e9s : comment sont r\u00e9alis\u00e9es les pistes - Summit Interconnect CA<\/title>\n<meta name=\"description\" content=\"Summit Interconnect, une soci\u00e9t\u00e9 de fabrication de circuits imprim\u00e9s, explique comment les traces sont r\u00e9alis\u00e9es gr\u00e2ce au processus de gravure, une \u00e9tape importante dans la fabrication rapide de circuits imprim\u00e9s.\" \/>\n<meta name=\"robots\" content=\"index, follow, max-snippet:-1, max-image-preview:large, max-video-preview:-1\" \/>\n<link rel=\"canonical\" href=\"https:\/\/summitinterconnect.ca\/fr\/blog\/article\/pcb-fabrication-basics-how-traces-are-made\/\" \/>\n<meta property=\"og:locale\" content=\"fr_FR\" \/>\n<meta property=\"og:type\" content=\"article\" \/>\n<meta property=\"og:title\" content=\"Notions de base sur la fabrication de circuits imprim\u00e9s : comment sont r\u00e9alis\u00e9es les pistes - 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