{"id":11290,"date":"2020-06-22T22:15:56","date_gmt":"2020-06-22T22:15:56","guid":{"rendered":"https:\/\/summitinterconnect.ca\/blog\/article\/remarque-sur-lintegrite-du-signal-pour-les-conceptions-a-4-couches\/"},"modified":"2025-12-17T10:48:49","modified_gmt":"2025-12-17T10:48:49","slug":"signal-integrity-note-for-4-layer-designs","status":"publish","type":"post","link":"https:\/\/summitinterconnect.ca\/fr\/blog\/article\/signal-integrity-note-for-4-layer-designs\/","title":{"rendered":"Remarque sur l'int\u00e9grit\u00e9 du signal pour les conceptions \u00e0 4 couches"},"content":{"rendered":"

Lorsque vous **routez une piste de signal**, il est essentiel de **prendre en compte le chemin de retour** de ce signal. <\/p>\n

Les **signaux de retour suivent le chemin d\u2019imp\u00e9dance minimale**, et non celui de **r\u00e9sistance minimale**. <\/p>\n

Id\u00e9alement, **chaque ligne de signal num\u00e9rique et chaque rail d\u2019alimentation** doit disposer **d\u2019un chemin de retour ininterrompu sur une couche adjacente**.
\nCependant, les **couches d\u2019un PCB n\u2019ont pas un espacement uniforme**, et de nombreux concepteurs **n\u00e9gligent ce d\u00e9tail**, en particulier au d\u00e9but de leur carri\u00e8re.<\/p>\n

### Probl\u00e8me de couplage des couches<\/p>\n

Si, par exemple, la **masse (GND) est plac\u00e9e sur la couche 3** et les **signaux sur la couche 4**, le **chemin de retour est proche**, ce qui permet de **contenir les lignes de champ** entre les couches **3 et 4**. <\/p>\n

Toutefois, cela cr\u00e9e un **mauvais couplage pour les couches 1 et 2**, qui sont trop \u00e9loign\u00e9es.
\n\u2013 Les **signaux sur la couche 1** ne pourront pas directement traverser la couche 2,
\n\u2013 Ils chercheront alors un autre **chemin de retour \u00e0 travers le plan d\u2019alimentation**,
\n\u2013 Cela **augmentera le bruit** sur le **rail d\u2019alimentation**.
\n\u2013 De plus, le **plan d\u2019alimentation sera trop \u00e9loign\u00e9 du plan de masse**, ce qui **favorisera la dispersion des lignes de champ** et **cr\u00e9era du bruit ind\u00e9sirable**.
\n\u2013 Enfin, **le couplage capacitif entre les plans sera faible**, r\u00e9duisant l\u2019efficacit\u00e9 du d\u00e9couplage.<\/p>\n

### Meilleure disposition pour un PCB \u00e0 4 couches<\/p>\n

Une meilleure conception consiste \u00e0 **placer la masse sur les couches 2 et 3** et \u00e0 utiliser les **couches 1 et 4 pour l\u2019alimentation et les signaux**. <\/p>\n

\u2013 La **courte distance** entre les couches assurera que les **signaux restent confin\u00e9s \u00e0 leurs chemins de retour**,
\n\u2013 Cela am\u00e9liorera **l\u2019int\u00e9grit\u00e9 du signal**,
\n\u2013 Et r\u00e9duira **le bruit** sur le **plan d\u2019alimentation**.<\/p>

\"\"<\/figure>

Cela \u00e9tant dit, en tant que concepteur d\u00e9butant, vous devriez vous en tenir \u00e0 la premi\u00e8re option, la moins pr\u00e9f\u00e9r\u00e9e. Vous aurez de quoi vous occuper du routage de votre premier projet sans avoir \u00e0 vous soucier de l'int\u00e9grit\u00e9 du signal et de l'alimentation. Notre premi\u00e8re conception peut \u00eatre r\u00e9alis\u00e9e sur une plaque d'essai sans soudure \u2013 \u00e0 l'exception de quelques composants, la disposition n'est pas terriblement critique. <\/p>","protected":false},"excerpt":{"rendered":"

Lorsque vous **routez une piste de signal**, il est essentiel de **prendre en compte le chemin de retour** de ce signal. Les **signaux de retour suivent le chemin d\u2019imp\u00e9dance minimale**, et non celui de **r\u00e9sistance minimale**. Id\u00e9alement, **chaque ligne de signal num\u00e9rique et chaque rail d\u2019alimentation** doit disposer **d\u2019un chemin de retour ininterrompu sur une […]<\/p>\n","protected":false},"author":3,"featured_media":0,"comment_status":"closed","ping_status":"closed","sticky":false,"template":"","format":"standard","meta":{"_acf_changed":false,"content-type":"","footnotes":""},"categories":[86],"tags":[],"class_list":["post-11290","post","type-post","status-publish","format-standard","hentry","category-conception"],"acf":[],"yoast_head":"\nRemarque sur l'int\u00e9grit\u00e9 du signal pour les conceptions \u00e0 4 couches - Summit Interconnect CA<\/title>\n<meta name=\"description\" content=\"Summit Interconnect, une soci\u00e9t\u00e9 de fabrication de circuits imprim\u00e9s, explique l'int\u00e9grit\u00e9 du signal pour les conceptions \u00e0 4 couches utilis\u00e9es dans les processus de fabrication de circuits imprim\u00e9s Quick Turn.\" \/>\n<meta name=\"robots\" content=\"index, follow, max-snippet:-1, max-image-preview:large, max-video-preview:-1\" \/>\n<link rel=\"canonical\" href=\"https:\/\/summitinterconnect.ca\/fr\/blog\/article\/signal-integrity-note-for-4-layer-designs\/\" \/>\n<meta property=\"og:locale\" content=\"fr_FR\" \/>\n<meta property=\"og:type\" content=\"article\" \/>\n<meta property=\"og:title\" content=\"Remarque sur l'int\u00e9grit\u00e9 du signal pour les conceptions \u00e0 4 couches - Summit Interconnect CA\" \/>\n<meta property=\"og:description\" content=\"Summit Interconnect, une soci\u00e9t\u00e9 de fabrication de circuits imprim\u00e9s, explique l'int\u00e9grit\u00e9 du signal pour les conceptions \u00e0 4 couches utilis\u00e9es dans les processus de fabrication de circuits imprim\u00e9s Quick Turn.\" \/>\n<meta property=\"og:url\" content=\"https:\/\/summitinterconnect.ca\/fr\/blog\/article\/signal-integrity-note-for-4-layer-designs\/\" \/>\n<meta property=\"og:site_name\" content=\"Summit Interconnect CA\" \/>\n<meta property=\"article:published_time\" content=\"2020-06-22T22:15:56+00:00\" \/>\n<meta property=\"article:modified_time\" content=\"2025-12-17T10:48:49+00:00\" \/>\n<meta property=\"og:image\" content=\"https:\/\/summitinterconnect.com\/wp-content\/uploads\/2022\/02\/blog-signal-image-1.jpg\" \/>\n<meta name=\"author\" content=\"Lisa Holmes\" \/>\n<meta name=\"twitter:card\" content=\"summary_large_image\" \/>\n<meta name=\"twitter:label1\" content=\"Written by\" \/>\n\t<meta name=\"twitter:data1\" content=\"Lisa Holmes\" \/>\n<script type=\"application\/ld+json\" class=\"yoast-schema-graph\">{\"@context\":\"https:\/\/schema.org\",\"@graph\":[{\"@type\":\"Article\",\"@id\":\"https:\/\/summitinterconnect.ca\/fr\/blog\/article\/signal-integrity-note-for-4-layer-designs\/#article\",\"isPartOf\":{\"@id\":\"https:\/\/summitinterconnect.ca\/fr\/blog\/article\/signal-integrity-note-for-4-layer-designs\/\"},\"author\":{\"name\":\"Lisa Holmes\",\"@id\":\"https:\/\/summitinterconnect.ca\/fr\/#\/schema\/person\/747c1b56e5f9edb8ba5900d796562bb9\"},\"headline\":\"Remarque sur l'int\u00e9grit\u00e9 du signal pour les conceptions \u00e0 4 couches\",\"datePublished\":\"2020-06-22T22:15:56+00:00\",\"dateModified\":\"2025-12-17T10:48:49+00:00\",\"mainEntityOfPage\":{\"@id\":\"https:\/\/summitinterconnect.ca\/fr\/blog\/article\/signal-integrity-note-for-4-layer-designs\/\"},\"wordCount\":384,\"image\":{\"@id\":\"https:\/\/summitinterconnect.ca\/fr\/blog\/article\/signal-integrity-note-for-4-layer-designs\/#primaryimage\"},\"thumbnailUrl\":\"https:\/\/summitinterconnect.com\/wp-content\/uploads\/2022\/02\/blog-signal-image-1.jpg\",\"articleSection\":[\"Conception\"],\"inLanguage\":\"fr-FR\"},{\"@type\":\"WebPage\",\"@id\":\"https:\/\/summitinterconnect.ca\/fr\/blog\/article\/signal-integrity-note-for-4-layer-designs\/\",\"url\":\"https:\/\/summitinterconnect.ca\/fr\/blog\/article\/signal-integrity-note-for-4-layer-designs\/\",\"name\":\"Remarque sur l'int\u00e9grit\u00e9 du signal pour les conceptions \u00e0 4 couches - 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