{"id":11286,"date":"2020-06-09T22:32:24","date_gmt":"2020-06-09T22:32:24","guid":{"rendered":"https:\/\/summitinterconnect.ca\/blog\/article\/concevoir-une-pile-de-couches\/"},"modified":"2025-12-17T10:48:46","modified_gmt":"2025-12-17T10:48:46","slug":"designing-a-layer-stack","status":"publish","type":"post","link":"https:\/\/summitinterconnect.ca\/fr\/blog\/article\/designing-a-layer-stack\/","title":{"rendered":"Concevoir une pile de couches"},"content":{"rendered":"<h2>Qu\u2019est-ce qu\u2019un Stackup ?<\/h2>\n<p>Les circuits imprim\u00e9s (PCB) sont constitu\u00e9s d\u2019une alternance de couches conductrices et isolantes (di\u00e9lectriques).<\/p>\n<p>Les PCB multicouches sont fabriqu\u00e9s de deux mani\u00e8res :<\/p>\n<p>En laminant plusieurs noyaux pr\u00e9fabriqu\u00e9s ensemble.<\/p>\n<p>En partant d\u2019un noyau et en laminant du cuivre en feuille sur les faces ext\u00e9rieures pour former les couches externes.<\/p>\n<p>Dans les PCB rigides, le conducteur est presque toujours du cuivre.<br \/>\nParfois, on peut trouver de l\u2019aluminium au centre du circuit imprim\u00e9, mais il est utilis\u00e9 comme dissipateur thermique, et non comme conducteur \u00e9lectrique.<\/p>\n<p>Les couches isolantes peuvent \u00eatre constitu\u00e9es de diff\u00e9rents mat\u00e9riaux, allant :<\/p>\n<p>De la fibre de verre (peu co\u00fbteuse et facile \u00e0 travailler).<\/p>\n<p>Au T\u00e9flon (tr\u00e8s co\u00fbteux et difficile \u00e0 fabriquer, utilis\u00e9 dans les circuits RF).<\/p>\n<p>Les couches de cuivre sont num\u00e9rot\u00e9es de haut en bas, et appel\u00e9es \u00abLayer 1\", \u00abLayer 2\", etc.<br \/>\nIl est aussi courant d\u2019entendre des d\u00e9signations comme :<\/p>\n<p>Inner-layer (couche interne)<\/p>\n<p>Outer-layer (couche externe)<\/p>\n<p>Plane-layer (plan d\u2019alimentation ou de masse)<\/p>\n<p>Signal-layer (couche de signal)<\/p>\n<p>Top-layer \/ Bottom-layer (couches sup\u00e9rieure et inf\u00e9rieure)<\/p>\n<h2>Sym\u00e9trie<\/h2>\n<p>Une r\u00e8gle g\u00e9n\u00e9rale pour concevoir un empilage de couches (stackup) est de veiller \u00e0 ce qu\u2019il soit sym\u00e9trique par rapport au centre du PCB.<\/p><figure class=\"img-caption\"><img decoding=\"async\" loading=\"lazy\" class=\"img-caption__img\" src=\"https:\/\/summitinterconnect.com\/wp-content\/uploads\/2022\/02\/blog-stackup-2-700x460-1.jpg\" alt=\"\"><figcaption class=\"img-caption__caption\">Cette conception rigide-flexible \u00e0 huit couches comporte deux couches flexibles avec deux couches suppl\u00e9mentaires lamin\u00e9es de chaque c\u00f4t\u00e9.<\/figcaption><\/figure><p>Si votre empilement n'est pas sym\u00e9trique, les coefficients de dilatation thermique diff\u00e9rentiels risquent de provoquer une d\u00e9formation de la carte lors de l'assemblage et du fonctionnement. Ce probl\u00e8me se pose principalement sur les circuits imprim\u00e9s tr\u00e8s fins. Le cuivre limite la dilatation aux endroits et dans les directions o\u00f9 elle est pr\u00e9sente, mais il n'a qu'une faible influence sur les directions lat\u00e9rales.  <\/p>\n<p>Ce type de d\u00e9formation est caus\u00e9 par une gravure in\u00e9gale du cuivre sur les c\u00f4t\u00e9s oppos\u00e9s d'un noyau.<\/p><figure class=\"img-caption\"><img decoding=\"async\" loading=\"lazy\" class=\"img-caption__img\" src=\"https:\/\/summitinterconnect.com\/wp-content\/uploads\/2022\/02\/blog-stackup-image-3-700x394-1.png\" alt=\"\"><\/figure><div class=\"blockquote\"><blockquote class=\"blockquote__quote\">La plupart des ing\u00e9nieurs savent qu'il est n\u00e9cessaire de concevoir un empilement de couches \u00e9quilibr\u00e9 pour \u00e9viter les d\u00e9formations lors de l'assemblage. Cependant, il arrive souvent que les ing\u00e9nieurs retirent de grandes quantit\u00e9s de cuivre lors du routage, ce qui entra\u00eene un empilement d\u00e9s\u00e9quilibr\u00e9. Si vous ne veillez pas \u00e0 la sym\u00e9trie du cuivre, vous finirez par concevoir une puce \u00e9lectronique.  <\/blockquote><div class=\"blockquote__author\"><\/div><\/div>","protected":false},"excerpt":{"rendered":"<p>Qu\u2019est-ce qu\u2019un Stackup ? Les circuits imprim\u00e9s (PCB) sont constitu\u00e9s d\u2019une alternance de couches conductrices et isolantes (di\u00e9lectriques). Les PCB multicouches sont fabriqu\u00e9s de deux mani\u00e8res : En laminant plusieurs noyaux pr\u00e9fabriqu\u00e9s ensemble. En partant d\u2019un noyau et en laminant du cuivre en feuille sur les faces ext\u00e9rieures pour former les couches externes. Dans les [&hellip;]<\/p>\n","protected":false},"author":3,"featured_media":0,"comment_status":"closed","ping_status":"closed","sticky":false,"template":"","format":"standard","meta":{"_acf_changed":false,"content-type":"","footnotes":""},"categories":[86,84],"tags":[],"class_list":["post-11286","post","type-post","status-publish","format-standard","hentry","category-conception","category-fabrication-fr"],"acf":[],"yoast_head":"<!-- This site is optimized with the Yoast SEO plugin v27.8 - https:\/\/yoast.com\/product\/yoast-seo-wordpress\/ -->\n<title>Concevoir une pile de couches - Summit Interconnect CA<\/title>\n<meta name=\"description\" content=\"Summit Interconnect, une soci\u00e9t\u00e9 de fabrication de circuits imprim\u00e9s, fournit des informations sur la conception d&#039;une pile de couches et sur la mani\u00e8re dont la terminologie des couches dans les cartes de circuits imprim\u00e9s est utilis\u00e9e.\" \/>\n<meta name=\"robots\" content=\"index, follow, max-snippet:-1, max-image-preview:large, max-video-preview:-1\" \/>\n<link rel=\"canonical\" href=\"https:\/\/summitinterconnect.ca\/fr\/blog\/article\/designing-a-layer-stack\/\" \/>\n<meta property=\"og:locale\" content=\"fr_FR\" \/>\n<meta property=\"og:type\" content=\"article\" \/>\n<meta property=\"og:title\" content=\"Concevoir une pile de couches - 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