{"id":11285,"date":"2020-07-14T21:56:56","date_gmt":"2020-07-14T21:56:56","guid":{"rendered":"https:\/\/summitinterconnect.ca\/blog\/article\/considerations-sur-la-dilatation-thermique\/"},"modified":"2025-12-17T10:48:45","modified_gmt":"2025-12-17T10:48:45","slug":"thermal-expansion-considerations","status":"publish","type":"post","link":"https:\/\/summitinterconnect.ca\/fr\/blog\/article\/thermal-expansion-considerations\/","title":{"rendered":"Consid\u00e9rations sur la dilatation thermique"},"content":{"rendered":"

Les **nouveaux concepteurs** ont tendance \u00e0 **retirer une grande quantit\u00e9 de cuivre** de leurs circuits imprim\u00e9s. <\/p>\n

Le probl\u00e8me avec cette approche est que, **si le cuivre n\u2019est pas r\u00e9parti de mani\u00e8re \u00e9gale** sur les **couches miroir** de la carte, il ne peut pas **contraindre uniform\u00e9ment l\u2019expansion des couches di\u00e9lectriques**. <\/p>\n

Cela peut entra\u00eener une **d\u00e9formation du circuit imprim\u00e9** lors du **refusion en convection**.<\/p>\n

\u00c0 moins que vous ne conceviez des circuits haute tension qui ont des exigences sp\u00e9cifiques en mati\u00e8re de fuite et de d\u00e9gagement, vous souhaiterez laisser autant de cuivre que possible sur votre carte pour \u00e9viter ce probl\u00e8me. Le moyen d'y parvenir est d'utiliser des coulages de cuivre. Vous pouvez utiliser des coulages de cuivre, grands et petits, pour couvrir certaines parties de votre carte et \u00e9viter cette d\u00e9formation. <\/p>\n

Voici un exemple de la diff\u00e9rence entre une carte avec des remplissages en cuivre et une carte sans. Sur cette carte, il y a si peu de cuivre que la d\u00e9formation ne posera probablement pas de probl\u00e8me avec ou sans remplissages en cuivre. <\/p>\n","protected":false},"excerpt":{"rendered":"

Les **nouveaux concepteurs** ont tendance \u00e0 **retirer une grande quantit\u00e9 de cuivre** de leurs circuits imprim\u00e9s. Le probl\u00e8me avec cette approche est que, **si le cuivre n\u2019est pas r\u00e9parti de mani\u00e8re \u00e9gale** sur les **couches miroir** de la carte, il ne peut pas **contraindre uniform\u00e9ment l\u2019expansion des couches di\u00e9lectriques**. Cela peut entra\u00eener une **d\u00e9formation du […]<\/p>\n","protected":false},"author":3,"featured_media":0,"comment_status":"closed","ping_status":"closed","sticky":false,"template":"","format":"standard","meta":{"_acf_changed":false,"content-type":"","footnotes":""},"categories":[86],"tags":[],"class_list":["post-11285","post","type-post","status-publish","format-standard","hentry","category-conception"],"acf":[],"yoast_head":"\nConsid\u00e9rations sur la dilatation thermique - Summit Interconnect CA<\/title>\n<meta name=\"description\" content=\"Summit Interconnect, une soci\u00e9t\u00e9 de fabrication de circuits imprim\u00e9s, explique les consid\u00e9rations relatives \u00e0 la dilatation thermique avec les utilisations des processus de fabrication de circuits imprim\u00e9s \u00e0 rotation rapide.\" \/>\n<meta name=\"robots\" content=\"index, follow, max-snippet:-1, max-image-preview:large, max-video-preview:-1\" \/>\n<link rel=\"canonical\" href=\"https:\/\/summitinterconnect.ca\/fr\/blog\/article\/thermal-expansion-considerations\/\" \/>\n<meta property=\"og:locale\" content=\"fr_FR\" \/>\n<meta property=\"og:type\" content=\"article\" \/>\n<meta property=\"og:title\" content=\"Consid\u00e9rations sur la dilatation thermique - Summit Interconnect CA\" \/>\n<meta property=\"og:description\" content=\"Summit Interconnect, une soci\u00e9t\u00e9 de fabrication de circuits imprim\u00e9s, explique les consid\u00e9rations relatives \u00e0 la dilatation thermique avec les utilisations des processus de fabrication de circuits imprim\u00e9s \u00e0 rotation rapide.\" \/>\n<meta property=\"og:url\" content=\"https:\/\/summitinterconnect.ca\/fr\/blog\/article\/thermal-expansion-considerations\/\" \/>\n<meta property=\"og:site_name\" content=\"Summit Interconnect CA\" \/>\n<meta property=\"article:published_time\" content=\"2020-07-14T21:56:56+00:00\" \/>\n<meta property=\"article:modified_time\" content=\"2025-12-17T10:48:45+00:00\" \/>\n<meta name=\"author\" content=\"Lisa Holmes\" \/>\n<meta name=\"twitter:card\" content=\"summary_large_image\" \/>\n<meta name=\"twitter:label1\" content=\"Written by\" \/>\n\t<meta name=\"twitter:data1\" content=\"Lisa Holmes\" \/>\n<script type=\"application\/ld+json\" class=\"yoast-schema-graph\">{\"@context\":\"https:\/\/schema.org\",\"@graph\":[{\"@type\":\"Article\",\"@id\":\"https:\/\/summitinterconnect.ca\/fr\/blog\/article\/thermal-expansion-considerations\/#article\",\"isPartOf\":{\"@id\":\"https:\/\/summitinterconnect.ca\/fr\/blog\/article\/thermal-expansion-considerations\/\"},\"author\":{\"name\":\"Lisa Holmes\",\"@id\":\"https:\/\/summitinterconnect.ca\/fr\/#\/schema\/person\/747c1b56e5f9edb8ba5900d796562bb9\"},\"headline\":\"Consid\u00e9rations sur la dilatation thermique\",\"datePublished\":\"2020-07-14T21:56:56+00:00\",\"dateModified\":\"2025-12-17T10:48:45+00:00\",\"mainEntityOfPage\":{\"@id\":\"https:\/\/summitinterconnect.ca\/fr\/blog\/article\/thermal-expansion-considerations\/\"},\"wordCount\":197,\"articleSection\":[\"Conception\"],\"inLanguage\":\"fr-FR\"},{\"@type\":\"WebPage\",\"@id\":\"https:\/\/summitinterconnect.ca\/fr\/blog\/article\/thermal-expansion-considerations\/\",\"url\":\"https:\/\/summitinterconnect.ca\/fr\/blog\/article\/thermal-expansion-considerations\/\",\"name\":\"Consid\u00e9rations sur la dilatation thermique - 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