{"id":11184,"date":"2023-02-02T20:58:19","date_gmt":"2023-02-02T20:58:19","guid":{"rendered":"https:\/\/summitinterconnect.ca\/blog\/article\/summit-interconnect-honore-cinq-nouveaux-diplomes-de-lipc-emerging-engineers\/"},"modified":"2025-12-17T10:48:10","modified_gmt":"2025-12-17T10:48:10","slug":"ipc-emerging-engineer-graduates-honored-summit","status":"publish","type":"post","link":"https:\/\/summitinterconnect.ca\/fr\/blog\/article\/ipc-emerging-engineer-graduates-honored-summit\/","title":{"rendered":"Summit Interconnect honore cinq nouveaux dipl\u00f4m\u00e9s de l'IPC Emerging Engineers"},"content":{"rendered":"<h2>Les employ\u00e9s du sommet repr\u00e9sentent plus de 25 % de la promotion 2023 des ing\u00e9nieurs \u00e9mergents d\u2019IPC<\/h2>\n<p>IPC a lanc\u00e9 le programme Emerging Engineers en 2016. L\u2019objectif du programme est de jumeler de jeunes professionnels avec des mentors qui peuvent offrir les conseils et les outils n\u00e9cessaires pour appliquer et d\u00e9velopper les normes de l\u2019industrie. Pour participer au programme, les professionnels doivent avoir travaill\u00e9 dans l\u2019industrie pendant moins de cinq ans ou \u00eatre \u00e9tudiants universitaires. Les mentors doivent avoir au moins sept ans d\u2019exp\u00e9rience dans l\u2019industrie et avoir si\u00e9g\u00e9 \u00e0 un comit\u00e9 de l\u2019IPC pendant au moins cinq ans. Il s\u2019agit d\u2019un engagement de trois ans pour mener \u00e0 bien le programme.    <\/p>\n<p>Selon le Dr John Mitchell, pr\u00e9sident et chef de la direction d\u2019IPC, \u00ab le programme IPC Emerging Engineer donne aux nouveaux ing\u00e9nieurs une longueur d\u2019avance d\u00e8s le d\u00e9but de leur carri\u00e8re. De plus, il permet aux experts de l\u2019industrie de partager leurs connaissances et leur expertise avec la prochaine g\u00e9n\u00e9ration d\u2019ing\u00e9nieurs. Nous travaillons tous ensemble pour rendre notre industrie plus forte.<\/p>\n<p>La semaine derni\u00e8re, Summit \u00e9tait fier que les membres de notre \u00e9quipe repr\u00e9sentent cinq des 18 dipl\u00f4m\u00e9s. Il s\u2019agit de : <\/p>\n<p><strong>Michael Lowry, Sommet \u2013 Orange  <\/strong><\/p>\n<p><strong>Deivy Bassotto, Sommet \u2013 Toronto<\/strong><\/p>\n<p><strong>Kevin Tlaxcalteca, Sommet \u2013 Orange<\/strong><\/p>\n<p><strong>Filomeno Ponce, Sommet \u2013 Santa Clara<\/strong><\/p>\n<p><strong>Aaron Kennedy, Sommet \u2013 Anaheim  <\/strong><\/p>\n<p>Sous la direction du vice-pr\u00e9sident de la technologie de Summit, Gerry Partida, ces personnes ont fait preuve d\u2019un leadership remarquable et illustrent l\u2019engagement in\u00e9branlable de Summit envers la qualit\u00e9 et le service. \u00ab Je pense qu\u2019il s\u2019agit d\u2019une r\u00e9alisation et d\u2019une reconnaissance exceptionnelles pour les dipl\u00f4m\u00e9s \u00bb, a d\u00e9clar\u00e9 M. Partida. \u00ab En soutenant ces leaders d\u2019opinion \u00e9mergents, Summit continue d\u2019investir dans l\u2019avenir de notre industrie. \u00bb  <\/p>\n<p>Lorsqu\u2019on leur a demand\u00e9 pourquoi ils avaient d\u00e9cid\u00e9 de participer et ce que signifiait pour eux l\u2019obtention d\u2019un dipl\u00f4me de ces programmes, voici ce que quelques-uns avaient \u00e0 dire :<\/p>\n<p>Michael Lowry, Superviseur de l\u2019ing\u00e9nierie chez Summit \u2013 Orange<\/p>\n<p><em>\u00ab J\u2019ai rejoint le programme Emerging Engineers pour m\u2019impliquer dans l\u2019industrie \u00e0 plus grande \u00e9chelle. Cette exposition m\u2019a permis d\u2019\u00e9largir ma compr\u00e9hension du r\u00f4le de Summit dans l\u2019industrie et m\u2019a donn\u00e9 un aper\u00e7u des exigences et des d\u00e9fis quotidiens auxquels nous sommes confront\u00e9s lors de la fabrication de circuits imprim\u00e9s. L\u2019obtention de mon dipl\u00f4me du programme t\u00e9moigne de mon investissement personnel dans l\u2019industrie et constitue une excellente base pour la croissance de ma carri\u00e8re.<\/em><\/p>\n<p>Deivy Bassotto, technicien AOI chez Summit \u2013 Toronto<\/p>\n<p><em>\u00ab Tout d\u2019abord, je tiens \u00e0 remercier Gerry Partida et Summit de m\u2019avoir encourag\u00e9 \u00e0 lancer ce programme. Cette opportunit\u00e9 a permis d\u2019accro\u00eetre mes connaissances en fabrication et en assemblage. Cela m\u2019a \u00e9galement donn\u00e9 une exp\u00e9rience qui m\u2019aidera \u00e0 l\u2019am\u00e9lioration continue de l\u2019entreprise. J\u2019ai eu l\u2019occasion de communiquer et de cr\u00e9er des liens avec des experts de l\u2019industrie, ce qui m\u2019aidera \u00e0 grandir et \u00e0 conqu\u00e9rir de nouveaux projets. Ce fut une exp\u00e9rience formidable et pour une personne qui veut \u00eatre dans l\u2019industrie des circuits imprim\u00e9s, ce programme est un must\u00a0!<\/em><\/p>\n<p>Filomeno Ponce, planificateur au Sommet \u2013 Santa Clara<\/p>\n<p><em>\u00ab J\u2019ai d\u00e9cid\u00e9 de participer au programme parce que j\u2019ai h\u00e2te d\u2019en apprendre le plus possible sur l\u2019industrie. J\u2019ai \u00e9galement vu cela comme une excellente occasion de r\u00e9seautage, puisque des coll\u00e8gues, des fournisseurs et des clients de toute l\u2019industrie assistent \u00e0 cet \u00e9v\u00e9nement. En participant \u00e0 ce programme, j\u2019ai appris \u00e0 mieux interpr\u00e9ter les normes de fabrication et de conception de l\u2019IPC. Maintenant, je sais ce qui est acceptable et ce qui ne l\u2019est pas sur la base de ces normes.<\/em><\/p>\n<p>F\u00e9licitations \u00e0 tous les r\u00e9cents dipl\u00f4m\u00e9s du programme Ing\u00e9nieurs de la rel\u00e8ve\u00a0! Si vous souhaitez participer au programme, le CIPVP accepte les demandes d\u00e8s maintenant. La date limite est le 10 novembre 2023. Vous pouvez remplir le formulaire sur le site Web de l\u2019IPC : <a href=\"https:\/\/www.ipc.org\/ipc-emerging-engineers-plan-future\">IPC Emerging Engineers \u2013 Plan for the Future | IPC International, Inc.<\/a>   <\/p><p>\u00a0<\/p>\n<p>\u00a0<\/p><div class=\"image-gallery\"><div class=\"image-gallery__img\"><img decoding=\"async\" loading=\"lazy\" src=\"https:\/\/summitinterconnect.com\/wp-content\/uploads\/2023\/02\/IPC-EE-1.png\" alt=\"\"><\/div><div class=\"image-gallery__img\"><img decoding=\"async\" loading=\"lazy\" src=\"https:\/\/summitinterconnect.com\/wp-content\/uploads\/2023\/02\/IPC-EE-1-1.jpg\" alt=\"\"><\/div><div class=\"image-gallery__img\"><img decoding=\"async\" loading=\"lazy\" src=\"https:\/\/summitinterconnect.com\/wp-content\/uploads\/2023\/02\/IPC-EE-1-2.png\" alt=\"\"><\/div><div class=\"image-gallery__img\"><img decoding=\"async\" loading=\"lazy\" src=\"https:\/\/summitinterconnect.com\/wp-content\/uploads\/2023\/02\/Group-Photo-IPC-EE-2023-1.jpg\" alt=\"\"><\/div><\/div>","protected":false},"excerpt":{"rendered":"<p>Les employ\u00e9s du sommet repr\u00e9sentent plus de 25 % de la promotion 2023 des ing\u00e9nieurs \u00e9mergents d\u2019IPC IPC a lanc\u00e9 le programme Emerging Engineers en 2016. L\u2019objectif du programme est de jumeler de jeunes professionnels avec des mentors qui peuvent offrir les conseils et les outils n\u00e9cessaires pour appliquer et d\u00e9velopper les normes de l\u2019industrie. [&hellip;]<\/p>\n","protected":false},"author":3,"featured_media":0,"comment_status":"closed","ping_status":"closed","sticky":false,"template":"","format":"standard","meta":{"_acf_changed":false,"content-type":"","footnotes":""},"categories":[82],"tags":[],"class_list":["post-11184","post","type-post","status-publish","format-standard","hentry","category-nouvelles"],"acf":[],"yoast_head":"<!-- This site is optimized with the Yoast SEO plugin v27.2 - https:\/\/yoast.com\/product\/yoast-seo-wordpress\/ -->\n<title>Summit Interconnect honore cinq nouveaux ing\u00e9nieurs dipl\u00f4m\u00e9s de l&#039;IPC<\/title>\n<meta name=\"description\" content=\"Summit Interconnect, une soci\u00e9t\u00e9 de fabrication de circuits imprim\u00e9s, a honor\u00e9 cinq nouveaux dipl\u00f4m\u00e9s en ing\u00e9nierie \u00e9mergents, du secteur de l&#039;\u00e9ducation aux professionnels de l&#039;entreprise.\" \/>\n<meta name=\"robots\" content=\"index, follow, max-snippet:-1, max-image-preview:large, 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