{"id":11155,"date":"2024-08-29T15:37:13","date_gmt":"2024-08-29T15:37:13","guid":{"rendered":"https:\/\/summitinterconnect.ca\/blog\/article\/modifications-recentes-apportees-a-laddenda-sur-lespace-ipc-6012f\/"},"modified":"2025-12-17T10:47:48","modified_gmt":"2025-12-17T10:47:48","slug":"recent-changes-to-ipc-6012fs","status":"publish","type":"post","link":"https:\/\/summitinterconnect.ca\/fr\/blog\/article\/recent-changes-to-ipc-6012fs\/","title":{"rendered":"Modifications r\u00e9centes apport\u00e9es \u00e0 l'addenda sur l'espace IPC-6012F"},"content":{"rendered":"<p>L'IPC a publi\u00e9 de nouvelles exigences de placage pour permettre des largeurs de ligne plus fines.<\/p>\n<p>Le tableau 3-10 ne n\u00e9cessite d\u00e9sormais que 5 \u00b5m[197 \u00b5in] placage d'enveloppement minimum pour les vias enterr\u00e9s> 2 couches, trous traversants et vias borgnes. Avant cette r\u00e9vision, l'\u00e9paisseur minimale de placage requise \u00e9tait de 12 \u00b5m.[472 \u00b5in] . <\/p>\n<p>Cette nouvelle tol\u00e9rance est utile aux fabricants de circuits imprim\u00e9s, car elle leur permet de mieux r\u00e9pondre aux exigences de largeurs de lignes fines et d'espacement en constante \u00e9volution, propres \u00e0 de nombreuses conceptions actuelles. En autorisant un placage minimum plus fin, les fabricants de circuits imprim\u00e9s peuvent viser une couche de placage moins importante \u00e0 la surface de la couche plaqu\u00e9e que la pr\u00e9c\u00e9dente r\u00e9vision. Cela permet de mieux contr\u00f4ler les exigences d'espacement fin, car la quantit\u00e9 totale de cuivre \u00e0 graver pour former les motifs et l'espacement du cuivre est r\u00e9duite.  <\/p><p style=\"text-align: center;\"><strong>Tableau 3-10 Cuivre de surface et de trou minimum<\/strong><br \/>\n <strong>Exigences relatives aux vias enterr\u00e9s> Couches, trous traversants et vias borgnes<\/strong><\/p><div class=\"table-wrapper\"><table class=\"table\"><tbody><tr><td>Minimum absolu  <\/td><td>25 \u00b5m (984 \u00b5in)<\/td><\/tr><tr><td>Envelopper<\/td><td>5 \u00b5m (197 \u00b5in)<\/td><\/tr><\/tbody><\/table><\/div><p>Remarque 1. Ne s'applique pas aux microvias (voir 1.4.4 de l'IPC-6012F) <\/p>\n<p>Remarque 2. Le placage cuivre des PTH et des vias <strong>doit<\/strong> \u00eatre conforme \u00e0 la section 3.6.2.11.1 de l'IPC-6012F. L'AABUS <strong>est<\/strong> une alternative au placage cuivre.  <\/p>\n<p>Remarque 3. Voir 3.6.2.11 de l'IPC-6012F. <\/p>","protected":false},"excerpt":{"rendered":"<p>L'IPC a publi\u00e9 de nouvelles exigences de placage pour permettre des largeurs de ligne plus fines. Le tableau 3-10 ne n\u00e9cessite d\u00e9sormais que 5 \u00b5m[197 \u00b5in] placage d'enveloppement minimum pour les vias enterr\u00e9s> 2 couches, trous traversants et vias borgnes. Avant cette r\u00e9vision, l'\u00e9paisseur minimale de placage requise \u00e9tait de 12 \u00b5m.[472 \u00b5in] . Cette [&hellip;]<\/p>\n","protected":false},"author":3,"featured_media":0,"comment_status":"closed","ping_status":"closed","sticky":false,"template":"","format":"standard","meta":{"_acf_changed":false,"content-type":"","footnotes":""},"categories":[75],"tags":[],"class_list":["post-11155","post","type-post","status-publish","format-standard","hentry","category-non-categorise"],"acf":[],"yoast_head":"<!-- This site is optimized with the Yoast SEO plugin v27.0 - https:\/\/yoast.com\/product\/yoast-seo-wordpress\/ -->\n<title>Modifications r\u00e9centes apport\u00e9es \u00e0 l&#039;addenda sur l&#039;espace IPC-6012F - Summit Interconnect CA<\/title>\n<meta name=\"robots\" content=\"index, follow, max-snippet:-1, max-image-preview:large, max-video-preview:-1\" \/>\n<link rel=\"canonical\" href=\"https:\/\/summitinterconnect.ca\/fr\/blog\/article\/recent-changes-to-ipc-6012fs\/\" \/>\n<meta property=\"og:locale\" content=\"fr_FR\" \/>\n<meta property=\"og:type\" content=\"article\" \/>\n<meta property=\"og:title\" content=\"Modifications r\u00e9centes apport\u00e9es \u00e0 l&#039;addenda sur l&#039;espace IPC-6012F - Summit Interconnect CA\" \/>\n<meta property=\"og:description\" content=\"L&#039;IPC a publi\u00e9 de nouvelles exigences de placage pour permettre des largeurs de ligne plus fines. Le tableau 3-10 ne n\u00e9cessite d\u00e9sormais que 5 \u00b5m[197 \u00b5in] placage d&#039;enveloppement minimum pour les vias enterr\u00e9s&gt; 2 couches, trous traversants et vias borgnes. Avant cette r\u00e9vision, l&#039;\u00e9paisseur minimale de placage requise \u00e9tait de 12 \u00b5m.[472 \u00b5in] . 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