{"id":14730,"date":"2026-04-05T19:42:32","date_gmt":"2026-04-05T19:42:32","guid":{"rendered":"https:\/\/summitinterconnect.ca\/capacites-de-fabrication\/"},"modified":"2026-07-03T15:47:11","modified_gmt":"2026-07-03T15:47:11","slug":"capacites-de-fabrication","status":"publish","type":"page","link":"https:\/\/summitinterconnect.ca\/fr\/capacites-de-fabrication\/","title":{"rendered":"Capacit\u00e9s de fabrication"},"content":{"rendered":"<section class=\"hero-corner-fold hcf space-210-100 bg-white align wp-block-acf-hero-corner-fold\">\n    <div class=\"mask-wrapper\">\n        <svg class=\"mask\" aria-hidden=\"true\" width=\"1\" height=\"1\" viewBox=\"0 0 1 1\" fill=\"none\" xmlns=\"http:\/\/www.w3.org\/2000\/svg\">\n    <defs>\n        <clipPath id=\"hcf-svg-mask\" clipPathUnits=\"objectBoundingBox\">\n            <path d=\"M0 0H1V0.534883L0.8 0.980562C0.79575 0.993118 0.787646 1 0.779271 1H0.5H0L0 0Z\" fill=\"#ffffff\"\/>\n        <\/clipPath>\n    <\/defs>\n<\/svg>\n\n<svg class=\"mask\" aria-hidden=\"true\" width=\"1\" height=\"1\" viewBox=\"0 0 1 1\" xmlns=\"http:\/\/www.w3.org\/2000\/svg\">\n    <defs>\n        <clipPath id=\"hcf-svg-mask-mobile\" clipPathUnits=\"objectBoundingBox\">\n            <path d=\"M0 0H1V0.824166L0.759203 0.971866C0.7297 0.989964 0.690628 1 0.652095 1H0.5H0L0 0Z\" fill=\"black\"\/>\n        <\/clipPath>\n    <\/defs>\n<\/svg>\n        <div class=\"hcf__background-container\" aria-hidden=\"true\">\n            <div class=\"hcf__background\">\n                <div class=\"hcf__decor-lines\">\n                    <span class=\"hcf__line-decor\" opacity-hide><\/span>\n                    <span class=\"hcf__line-decor\" opacity-hide><\/span>\n                    <span class=\"hcf__line-decor\" opacity-hide><\/span>\n                    <span class=\"hcf__line-decor\" opacity-hide><\/span>\n                    <span class=\"hcf__line-decor\" opacity-hide><\/span>\n                    <span class=\"hcf__line-decor\" opacity-hide><\/span>\n                    <span class=\"hcf__line-decor\" opacity-hide><\/span>\n                <\/div>\n            <\/div>\n            <div class=\"container\">\n                <div class=\"hcf__content-wrapper\">\n                    <div class=\"hcf__headline\">\n                                                    <h1 class=\"hcf__title h1-to-h1-mobile\" opacity-hide>\n                                Capacit\u00e9s de fabrication de PCB avanc\u00e9es                             <\/h1>\n                                                    <div class=\"hcf__description body-text-1\" opacity-hide>\n                                <p>Nos installations pilot\u00e9es par logiciel offrent des solutions compl\u00e8tes de fabrication de circuits imprim\u00e9s pour toutes les applications, des prototypes de PCB rapides aux cartes d'interconnexion \u00e0 haute densit\u00e9 (HDI) avec structures de vias avanc\u00e9es.<br \/>\n<br \/>Besoin d'une solution PCB sur mesure ? Notre \u00e9quipe d'ing\u00e9nierie peut fournir un support d'expertise en conception pour la fabricabilit\u00e9 (DFM) afin d'optimiser votre implantation de PCB avant la production.<\/p>\n                            <\/div>\n                                            <\/div>\n                        <a href=\"https:\/\/summitinterconnect.ca\/fr\/contact-us\/\" target=\"\"\n       class=\"btn --big --dark\"\n        opacity-hide    >\n        <span class=\"btn__icon btn__icon--left\"><\/span>\n        <span class=\"btn__text\">Contactez-nous<\/span>\n        <span class=\"btn__icon btn__icon--right\"><\/span>\n    <\/a>\n                <\/div>\n            <\/div>\n        <\/div>\n    <\/div>\n<\/section>\n\n\n\n<section class=\"table-of-content-section has-buttons bg-white\">\n    <div class=\"table-of-content-section__big-container container\">\n        <div class=\"table-of-content-section__container\">\n            <div class=\"table-of-content-section__body\" data-fade-up>\n                <div class=\"table-of-content-section__anchor-list-wrapper\">\n                    <div class=\"table-of-content-section__anchor-list-sticky-box\">\n                        <button class=\"table-of-content-section__open-list\" role=\"button\" aria-expanded=\"false\">\n              <span class=\"table-of-content-section__anchor-title\">\n                Sp\u00e9cifications de fabrication              <\/span>\n                            <span aria-hidden=\"true\" class=\"table-of-content-section__open-list-decor\">\n                <img decoding=\"async\" src=\"https:\/\/summitinterconnect.ca\/wp-content\/themes\/summit\/assets\/images\/svg\/arrow-blue.svg\"\n                     alt=\"arrow-blue\">\n              <\/span>\n                        <\/button>\n\n                        <div class=\"table-of-content-section__anchor-list-box\">\n                            <ol class=\"table-of-content-section__anchor-list\"><\/ol>\n                        <\/div>\n                    <\/div>\n                <\/div>\n                <div class=\"table-of-content-section__content js-toc-scope\">\n                                            <div class=\"table-of-content-section__chips-wrapper\">\n                            <a class=\"btn-chips --active\" href=\"#\">Fabrication<\/a><a class=\"btn-chips \" href=\"https:\/\/summitinterconnect.com\/capabilities-assembly\/\">Assembl\u00e9e<\/a>                        <\/div>\n                                        \n\n<h2 class=\"wp-block-heading has-36-30-font-size\" id=\"h-lamination\">Laminage<\/h2>\n\n\n\n<p>Le per\u00e7age est une m\u00e9thode \u00e9conomique permettant d'am\u00e9liorer l'int\u00e9grit\u00e9 du signal sans ajouter de structures de sous-lamination suppl\u00e9mentaires co\u00fbteuses. Ce proc\u00e9d\u00e9 permet de supprimer la partie inutile d'un cylindre de via qui peut provoquer des r\u00e9flexions de signal \u00e0 des d\u00e9bits de donn\u00e9es \u00e9lev\u00e9s ou sur des conceptions RF \u00e0 haute fr\u00e9quence. <\/p>\n\n\n\n<figure class=\"wp-block-table\"><table class=\"has-fixed-layout\"><thead><tr><th>D\u00e9tails du conseil d'administration<\/th><th>Standard<\/th><th>Avanc\u00e9<\/th><th>Technologies \u00e9mergentes<\/th><\/tr><\/thead><tbody><tr><td>Nombre de couches<\/td><td>2-30<\/td><td>32+<\/td><td>&gt;48<\/td><\/tr><tr><td>Taille minimale du panneau<\/td><td>12\u2033 x 18\u2033<\/td><td><\/td><td><\/td><\/tr><tr><td>Taille maximale du panneau<\/td><td>18\u2033 x 24\u2033<\/td><td>21\u2033 x 24\u2033<\/td><td>24\u2033 x 30\u2033<\/td><\/tr><tr><td>Couches HDI<\/td><td>2 \u2013 3<\/td><td>4<\/td><td>8+ selon le type de stratifi\u00e9 autoris\u00e9<\/td><\/tr><tr><td>Laminations s\u00e9quentielles<\/td><td>2 \u2013 3<\/td><td>4<\/td><td>8+ selon le type de stratifi\u00e9 autoris\u00e9<\/td><\/tr><tr><td>Enregistrement couche \u00e0 couche<\/td><td>+\/- .002\u2033<\/td><td><\/td><td><\/td><\/tr><\/tbody><\/table><\/figure>\n\n\n\n<h2 class=\"wp-block-heading\" id=\"h-thickness\">\u00c9paisseur<\/h2>\n\n\n\n<p>Les facteurs de conception et de fabrication d\u00e9terminent g\u00e9n\u00e9ralement l\u2019\u00e9paisseur des PCB.<br><\/p>\n\n\n\n<figure class=\"wp-block-table\"><table class=\"has-fixed-layout\"><thead><tr><th>\u00c9paisseur<\/th><th>Standard<\/th><th>Avanc\u00e9<\/th><th>Technologies \u00e9mergentes<\/th><\/tr><\/thead><tbody><tr><td>\u00c9paisseur minimale de la carte, simple\/double face<\/td><td>.005\u2033<\/td><td><\/td><td>002<\/td><\/tr><tr><td>\u00c9paisseur maximale de la carte<\/td><td>.250\u2033<\/td><td><\/td><td>.300\u2033<\/td><\/tr><tr><td>\u00c9paisseur minimale du noyau<\/td><td>.001\u2033<\/td><td><\/td><td>.0005\u2033<\/td><\/tr><tr><td>\u00c9paisseur minimale du noyau (BC, Kapton)<\/td><td>.002\u2033<\/td><td>.001\u2033<\/td><td>.0005\u2033<\/td><\/tr><tr><td>Remplissage minimal du pr\u00e9impr\u00e9gn\u00e9<\/td><td>.003\u2033<\/td><td>.002\u2033<\/td><td>&lt;.002&gt;<\/td><\/tr><\/tbody><\/table><\/figure>\n\n\n\n<h2 class=\"wp-block-heading\" id=\"h-drill-and-mill\">Per\u00e7age et Fraisage<\/h2>\n\n\n\n<p>Le per\u00e7age et le fraisage des circuits imprim\u00e9s cr\u00e9ent des trous, des fentes et d\u2019autres cavit\u00e9s dans une carte de circuit \u00e9lectronique.<br><\/p>\n\n\n\n<figure class=\"wp-block-table\"><table class=\"has-fixed-layout\"><thead><tr><th class=\"has-text-align-left\" data-align=\"left\">Per\u00e7age et Fraisage<\/th><th class=\"has-text-align-left\" data-align=\"left\">Standard<\/th><th class=\"has-text-align-left\" data-align=\"left\">Avanc\u00e9<\/th><th class=\"has-text-align-left\" data-align=\"left\">Technologies \u00e9mergentes<\/th><\/tr><\/thead><tbody><tr><td>Diam\u00e8tre de per\u00e7age minimal, per\u00e7age m\u00e9canique<\/td><td>.006\u2033<\/td><td>.005\u2033<\/td><td>.004\u2033<\/td><\/tr><tr><td>Rapport de forme du per\u00e7age m\u00e9canique, non bouch\u00e9<\/td><td>12:01<\/td><td>15:01<\/td><td>30:1<\/td><\/tr><tr><td>Rapport de forme du per\u00e7age m\u00e9canique, bouch\u00e9<\/td><td>10:01<\/td><td>11:01<\/td><td>&gt; 11:1<\/td><\/tr><tr><td>Distance per\u00e7age \u00e0 m\u00e9tal (rigide)<\/td><td>.008\u2033<\/td><td>.007\u2033<\/td><td>.00525\u2033<\/td><\/tr><tr><td>Distance per\u00e7age \u00e0 m\u00e9tal (flexible)<\/td><td>.012\u2033<\/td><td>.007\u2033<\/td><td>.00525\u2033<\/td><\/tr><tr><td>Distance per\u00e7age au bord de transition rigide-flex<\/td><td>.100\u2033<\/td><td>.075\u2033<\/td><td>&lt; .050\"<\/td><\/tr><tr><td>Diam\u00e8tre de l'anti-pastille par rapport au per\u00e7age<\/td><td>.020\u2033 +<\/td><td>.016\u2033<\/td><td>&lt; .050\"<\/td><\/tr><tr><td>Bague d'accueil minimale (Classe 2), per\u00e7age m\u00e9canique<\/td><td>.005\u2033<\/td><td>.004\u2033<\/td><td>&lt;.004&gt;<\/td><\/tr><tr><td>Bague d'accueil minimale (Classe 3), per\u00e7age m\u00e9canique<\/td><td>.007\u2033<\/td><td>.006\u2033<\/td><td>&lt;.006&gt;<\/td><\/tr><tr><td>Diam\u00e8tre de per\u00e7age minimal, micro-via laser<\/td><td>.004\u2033<\/td><td>.003\u2033<\/td><td>&lt;.003&gt;<\/td><\/tr><tr><td>Rapport de forme du micro-via<\/td><td>0.6:1<\/td><td>0.7:1<\/td><td>&gt;0.7:1<\/td><\/tr><tr><td>Pastille de capture \/ Per\u00e7age micro-via<\/td><td>+.007\u2033<\/td><td>+.005\u2033<\/td><td>+.004\u2033<\/td><\/tr><tr><td>Tol\u00e9rance de profondeur du per\u00e7age contr\u00f4l\u00e9<\/td><td>Retrait : .010\u2033 +\/- .005\u2033<\/td><td>Retrait : .005\u2033 +\/- .002\u2033<\/td><td>Retrait : .004 +\/- .0015\u2033<\/td><\/tr><tr><td>Surdimensionnement du back-drilling par rapport au per\u00e7age primaire<\/td><td>.008\u2033<\/td><td>.007\u2033<\/td><td>&lt;.007&gt;<\/td><\/tr><tr><td>Anti-pastille de back-drilling, surdimensionnement par rapport au per\u00e7age primaire<\/td><td>.016\u2033<\/td><td>.014\u2033<\/td><td>&lt;.014&gt;<\/td><\/tr><\/tbody><\/table><\/figure>\n\n\n\n<h2 class=\"wp-block-heading\" id=\"index-1parent-4\">Caract\u00e9ristiques de gravure<\/h2>\n\n\n\n<p>Le cuivre est l'un des \u00e9l\u00e9ments les plus importants des circuits imprim\u00e9s. La capacit\u00e9 de transport de courant d'un circuit imprim\u00e9 d\u00e9pend de l'\u00e9paisseur de la piste de cuivre. <\/p>\n\n\n\n<p>Les traces de cuivre sont r\u00e9alis\u00e9es en utilisant des produits chimiques pour graver ou retirer le cuivre de la carte, sauf l\u00e0 o\u00f9 les connexions c\u00e2bl\u00e9es sont pr\u00e9sentes.<\/p>\n\n\n\n<figure class=\"wp-block-table\"><table class=\"has-fixed-layout\"><thead><tr><th class=\"has-text-align-left\" data-align=\"left\">Caract\u00e9ristiques de gravure<\/th><th class=\"has-text-align-left\" data-align=\"left\">Standard<\/th><th class=\"has-text-align-left\" data-align=\"left\">Avanc\u00e9<\/th><th class=\"has-text-align-left\" data-align=\"left\">Technologies \u00e9mergentes<\/th><\/tr><\/thead><tbody><tr><td>Feuille de cuivre minimale \u2013 couches internes<\/td><td>1\/2 oz.<\/td><td>1\/4 oz.<\/td><td>1\/4 oz.<\/td><\/tr><tr><td>Feuille de cuivre maximale \u2013 couches internes<\/td><td>2 oz.<\/td><td>4 oz.<\/td><td>6 oz<\/td><\/tr><tr><td>Feuille de cuivre minimale \u2013 couches externes<\/td><td>3\/8 oz.<\/td><td>1\/4 oz.<\/td><td>1\/4 oz<\/td><\/tr><tr><td>Feuille de cuivre minimale \u2013 couches externes<\/td><td>1 oz.<\/td><td>3 oz.<\/td><td>&gt;3 oz<\/td><\/tr><\/tbody><\/table><\/figure>\n\n\n\n<h2 class=\"wp-block-heading\" id=\"index-1parent-5\">Couches int\u00e9rieures et ext\u00e9rieures imprim\u00e9es et grav\u00e9es<\/h2>\n\n\n\n<p>Les exigences en mati\u00e8re de largeur et d'espacement des pistes d\u00e9pendent de la fonctionnalit\u00e9 du circuit. Elles peuvent affecter les performances \u00e9lectriques et l'int\u00e9grit\u00e9 du signal. <\/p>\n\n\n\n<figure class=\"wp-block-table\"><table class=\"has-fixed-layout\"><thead><tr><th class=\"has-text-align-left\" data-align=\"left\">Couches internes<\/th><th class=\"has-text-align-left\" data-align=\"left\">Standard<\/th><th class=\"has-text-align-left\" data-align=\"left\">Avanc\u00e9<\/th><th class=\"has-text-align-left\" data-align=\"left\">Technologies \u00e9mergentes<\/th><\/tr><\/thead><tbody><tr><td>Largeur de piste \/ Isolement minimum, cuivre 1\/4 once<\/td><td>.002\u2033<\/td><td><\/td><td>&lt;.002&gt;<\/td><\/tr><tr><td>Largeur de piste \/ Isolement minimum, cuivre 3\/8 once<\/td><td>.003\u2033\/.003\u2033<\/td><td>.0025\u2033\/.003\u2033<\/td><td>&lt;.0025&gt;<\/td><\/tr><tr><td>Largeur de piste \/ Isolement minimum, cuivre 1\/2 once<\/td><td>.004\u2033\/.004\u2033<\/td><td>.003\u2033\/.003\u2033<\/td><td>&lt;.0025&gt;<\/td><\/tr><tr><td>Largeur de piste \/ Isolement minimum, cuivre 1 once<\/td><td>.005\u2033\/.005\u2033<\/td><td>.004\u2033\/.004\u2033<\/td><td>.0035\u2033\/.004\u2033<\/td><\/tr><tr><td>Largeur de piste \/ Isolement minimum, cuivre 2 onces<\/td><td>.008\u2033\/.008\u2033<\/td><td>.006\u2033\/.008\u2033<\/td><td>.006\u2033\/.006\u2033<\/td><\/tr><tr><td>Largeur de piste \/ Isolement minimum, cuivre 3 onces<\/td><td>.010\u2033\/.010\u2033<\/td><td>.008\u2033\/.010\u2033<\/td><td>.008\u2033\/.008\u2033<\/td><\/tr><\/tbody><\/table><\/figure>\n\n\n\n<figure class=\"wp-block-table\"><table class=\"has-fixed-layout\"><thead><tr><th class=\"has-text-align-left\" data-align=\"left\">Couches externes m\u00e9tallis\u00e9es<\/th><th class=\"has-text-align-left\" data-align=\"left\">Standard<\/th><th class=\"has-text-align-left\" data-align=\"left\">Avanc\u00e9<\/th><th class=\"has-text-align-left\" data-align=\"left\">Technologies \u00e9mergentes<\/th><\/tr><\/thead><tbody><tr><td>Largeur de piste \/ Isolement minimum, cuivre 1\/4 once<\/td><td><\/td><td>.0025\u2033\/.0025\u2033<\/td><td>.002\u2033\/.002\u2033<\/td><\/tr><tr><td>Largeur de piste \/ Isolement minimum, cuivre 3\/8 once<\/td><td>.004\u2033\/.004\u2033<\/td><td>.003\u2033\/.003\u2033<\/td><td>.0025\u2033\/.003\u2033<\/td><\/tr><tr><td>Largeur de piste \/ Isolement minimum, cuivre 1\/2 once<\/td><td>.005\u2033\/.005\u2033<\/td><td>.004\u2033\/.004\u2033<\/td><td>.003\u2033\/.004\u2033<\/td><\/tr><tr><td>Largeur de piste \/ Isolement minimum, cuivre 1 once<\/td><td>.006\u2033\/.006\u2033<\/td><td>.005\u2033\/.005\u2033<\/td><td>.004\u2033\/.005\u2033<\/td><\/tr><tr><td>Largeur de piste \/ Isolement minimum, cuivre 2 onces<\/td><td>.012\u2033\/.012\u2033<\/td><td>.010\u2033\/.010\u2033<\/td><td>.008\u2033\/.008\u2033<\/td><\/tr><tr><td>Isolement entre plan de cuivre et pastilles annulaires (donuts)<\/td><td>.006\u2033<\/td><td>.005\u2033<\/td><td>.005\u2033<\/td><\/tr><\/tbody><\/table><\/figure>\n\n\n\n<h2 class=\"wp-block-heading\" id=\"index-1parent-6\">Soldermask<\/h2>\n\n\n\n<p>Le vernis de soudure est une fine couche de polym\u00e8re qui prot\u00e8ge les PCB de l'oxydation et de la corrosion. Il permet \u00e9galement d'\u00e9viter les ponts de soudure et donne de la couleur \u00e0 la carte. <\/p>\n\n\n\n<figure class=\"wp-block-table\"><table class=\"has-fixed-layout\"><thead><tr><th class=\"has-text-align-left\" data-align=\"left\">Soldermask<\/th><th class=\"has-text-align-left\" data-align=\"left\">Standard<\/th><th class=\"has-text-align-left\" data-align=\"left\">Avanc\u00e9<\/th><th class=\"has-text-align-left\" data-align=\"left\">Technologies \u00e9mergentes<\/th><\/tr><\/thead><tbody><tr><td>Largeur de pont de vernis minimale (LDI), couleur verte<\/td><td>.004\u2033<\/td><td>.003\u2033<\/td><td>Inf\u00e9rieur \u00e0 .003\u2033<\/td><\/tr><tr><td>Garde du vernis \u00e9pargne<\/td><td>+\/-.002\u2033<\/td><td>+\/-.0015\u2033<\/td><td>Inf\u00e9rieur \u00e0 +\/- .0015\u2033<\/td><\/tr><\/tbody><\/table><\/figure>\n\n\n\n<h2 class=\"wp-block-heading\" id=\"index-1parent-7\">S\u00e9rigraphie<\/h2>\n\n\n\n<p>Alors que de plus en plus de circuits imprim\u00e9s \u00e9voluent vers la haute densit\u00e9, la flexibilit\u00e9 et la miniaturisation des composants, la qualit\u00e9 et la lisibilit\u00e9 d'une l\u00e9gende sont plus importantes que jamais.<\/p>\n\n\n\n<figure class=\"wp-block-table\"><table class=\"has-fixed-layout\"><thead><tr><th class=\"has-text-align-left\" data-align=\"left\">S\u00e9rigraphie<\/th><th class=\"has-text-align-left\" data-align=\"left\">Standard<\/th><th class=\"has-text-align-left\" data-align=\"left\">Avanc\u00e9<\/th><th class=\"has-text-align-left\" data-align=\"left\">Technologies \u00e9mergentes<\/th><\/tr><\/thead><tbody><tr><td>Impression de marquage par jet d'encre<\/td><td>Blanc<\/td><td>Blanc<\/td><td>Blanc<\/td><\/tr><tr><td>Options de couleurs<\/td><td>Vert<\/td><td>Rouge, Bleu, Noir, Blanc<\/td><td>Rouge, Bleu, Noir, Blanc<\/td><\/tr><\/tbody><\/table><\/figure>\n\n\n\n<h2 class=\"wp-block-heading\" id=\"index-1parent-8\">M\u00e9canique<\/h2>\n\n\n\n<figure class=\"wp-block-table\"><table class=\"has-fixed-layout\"><thead><tr><th class=\"has-text-align-left\" data-align=\"left\">M\u00e9canique<\/th><th class=\"has-text-align-left\" data-align=\"left\">Standard<\/th><th class=\"has-text-align-left\" data-align=\"left\">Avanc\u00e9<\/th><th class=\"has-text-align-left\" data-align=\"left\">Technologies \u00e9mergentes<\/th><\/tr><\/thead><tbody><tr><td>Tol\u00e9rance dimensionnelle du contour de la carte<\/td><td>+\/- .005\u2033<\/td><td>+\/- .002\u2033<\/td><td><wpml_root><\/wpml_root><\/td><\/tr><tr><td>Tol\u00e9rance du diam\u00e8tre des trous m\u00e9tallis\u00e9s<\/td><td>+\/-.003\u2033<\/td><td>+\/-.002\u2033<\/td><td><wpml_root><\/wpml_root><\/td><\/tr><tr><td>Tol\u00e9rance du diam\u00e8tre des trous non m\u00e9tallis\u00e9s<\/td><td>+.002\u2033\/<br\/>-.001\u2033<\/td><td>+\/-.001\u2033<\/td><td><wpml_root><\/wpml_root><\/td><\/tr><tr><td>Plan\u00e9it\u00e9, tuilage et gauchissement (selon IPC-TM-650 2.4.22)<\/td><td>&lt;.75&gt;<\/td><td>&lt;.5% Construction \u00e9quilibr\u00e9e<\/td><td>Constructions d\u00e9s\u00e9quilibr\u00e9es AABUS<\/td><\/tr><\/tbody><\/table><\/figure>\n\n\n\n<h2 class=\"wp-block-heading\" id=\"index-1parent-9\">Contr\u00f4le d'imp\u00e9dance<\/h2>\n\n\n\n<figure class=\"wp-block-table\"><table class=\"has-fixed-layout\"><thead><tr><th class=\"has-text-align-left\" data-align=\"left\">Contr\u00f4le d'imp\u00e9dance<\/th><th class=\"has-text-align-left\" data-align=\"left\">Standard<\/th><th class=\"has-text-align-left\" data-align=\"left\">Avanc\u00e9<\/th><th class=\"has-text-align-left\" data-align=\"left\">Technologies \u00e9mergentes<\/th><\/tr><\/thead><tbody><tr><td>Imp\u00e9dance contr\u00f4l\u00e9e \u2013 asym\u00e9trique +\/- %<\/td><td>+\/- 10%<\/td><td>+\/- 5%<\/td><td><wpml_root><\/wpml_root><\/td><\/tr><tr><td>Imp\u00e9dance contr\u00f4l\u00e9e \u2013 paire diff\u00e9rentielle \u00e0 couplage lat\u00e9ral +\/- %<\/td><td>+\/- 10%<\/td><td>+\/- 8%<\/td><td><wpml_root><\/wpml_root><\/td><\/tr><tr><td>Imp\u00e9dance contr\u00f4l\u00e9e \u2013 paire diff\u00e9rentielle \u00e0 couplage vertical +\/- %<\/td><td>+\/- 10%<\/td><td>+\/- 8%<\/td><td>+\/- 5%<\/td><\/tr><\/tbody><\/table><\/figure>\n\n\n\n<h2 class=\"wp-block-heading\" id=\"index-1parent-10\">Galvanoplastie<\/h2>\n\n\n\n<p>Le proc\u00e9d\u00e9 de galvanoplastie consiste \u00e0 d\u00e9poser du m\u00e9tal sur la surface du circuit imprim\u00e9 et \u00e0 l'int\u00e9rieur des trous traversants plaqu\u00e9s. Le m\u00e9tal plaqu\u00e9 le plus courant est le cuivre. <\/p>\n\n\n\n<figure class=\"wp-block-table\"><table class=\"has-fixed-layout\"><thead><tr><th class=\"has-text-align-left\" data-align=\"left\">Galvanoplastie<\/th><th class=\"has-text-align-left\" data-align=\"left\">Standard<\/th><th class=\"has-text-align-left\" data-align=\"left\">Avanc\u00e9<\/th><\/tr><\/thead><tbody><tr><td>Nickel \u00e0 faible contrainte<\/td><td>100 micropouces<\/td><td>250 micropouces<\/td><\/tr><tr><td>\u00c9paisseur du placage \u00e0 l'or<\/td><td>30 micropouces<\/td><td>Comme sp\u00e9cifi\u00e9<\/td><\/tr><tr><td>Rapport hauteur\/largeur du trou<\/td><td>12 \u00e0 1<\/td><td>20 contre 1<\/td><\/tr><\/tbody><\/table><\/figure>\n\n\n\n<h2 class=\"wp-block-heading\" id=\"index-1parent-11\">Finitions<\/h2>\n\n\n\n<p>La finition d'une carte, parfois n\u00e9glig\u00e9e, est l'interface entre la carte et les composants qui font fonctionner la carte comme souhait\u00e9.<\/p>\n\n\n\n<figure class=\"wp-block-table\"><table class=\"has-fixed-layout\"><thead><tr><th class=\"has-text-align-left\" data-align=\"left\">Finitions<\/th><th class=\"has-text-align-left\" data-align=\"left\">Standard<\/th><th class=\"has-text-align-left\" data-align=\"left\">Avanc\u00e9<\/th><\/tr><\/thead><tbody><tr><td>HASL &amp; HASL SANS PB<\/td><td>Oui<\/td><td>Oui<\/td><\/tr><tr><td>\u00c9tain blanc<\/td><td>Oui<\/td><td>Oui<\/td><\/tr><tr><td>Nickel\/Palladium\/Or autocatalytique -ENEPIG<\/td><td>Oui<\/td><td>Oui<\/td><\/tr><tr><td>Nickel Chimique \/ Or en Immersion \u2013 ENIG<\/td><td>Oui<\/td><td>Oui<\/td><\/tr><tr><td>Immersion Argent<\/td><td>Oui<\/td><td>Oui<\/td><\/tr><tr><td>Entek Plus HT\/OSP<\/td><td>Oui<\/td><td>Oui<\/td><\/tr><\/tbody><\/table><\/figure>\n\n\n\n<h2 class=\"wp-block-heading\" id=\"index-1parent-12\">Vias<\/h2>\n\n\n\n<p>Les vias \u00e9tablissent des connexions \u00e9lectriques entre les couches d'un circuit imprim\u00e9. Ils peuvent transporter des signaux ou de l'\u00e9nergie entre les couches. Summit est sp\u00e9cialis\u00e9 dans les technologies avanc\u00e9es de circuits imprim\u00e9s telles que les vias borgnes, les vias enterr\u00e9s et les vias dans les pads.  <\/p>\n\n\n\n<figure class=\"wp-block-table\"><table class=\"has-fixed-layout\"><thead><tr><th class=\"has-text-align-left\" data-align=\"left\">Types de vias<\/th><th class=\"has-text-align-left\" data-align=\"left\">Standard<\/th><th class=\"has-text-align-left\" data-align=\"left\">Avanc\u00e9<\/th><\/tr><\/thead><tbody><tr><td>Micro-vias laser<\/td><td>.006\u2033<\/td><td>&lt;.006&gt;<\/td><\/tr><tr><td>Vias borgnes\/enterr\u00e9es<\/td><td>.006\u2033<\/td><td>&lt; .006\u2033<\/td><\/tr><tr><td>Via dans Pad<\/td><td>Oui<\/td><td>Oui<\/td><\/tr><\/tbody><\/table><\/figure>\n\n\n\n<figure class=\"wp-block-table\"><table class=\"has-fixed-layout\"><thead><tr><th class=\"has-text-align-left\" data-align=\"left\">Via Remplissage<\/th><th class=\"has-text-align-left\" data-align=\"left\">Standard<\/th><th class=\"has-text-align-left\" data-align=\"left\">Avanc\u00e9<\/th><\/tr><\/thead><tbody><tr><td>ViaFill non conducteur<\/td><td>Oui<\/td><td>Oui<\/td><\/tr><tr><td>Remplissage de vias en argent\/\u00e9poxy conducteur<\/td><td>Non<\/td><td>Oui<\/td><\/tr><tr><td>Vias remplis de cuivre<\/td><td>Non<\/td><td>Oui<\/td><\/tr><tr><td>Trou traversant rempli de cuivre<\/td><td>Non<\/td><td>Max 20 mils<\/td><\/tr><\/tbody><\/table><\/figure>\n\n\n\n<h2 class=\"wp-block-heading\" id=\"index-1parent-13\">Processus et options d'inspection<\/h2>\n\n\n\n<p>Des tests et des inspections approfondis sont effectu\u00e9s tout au long du processus de production pour garantir que les probl\u00e8mes sont d\u00e9tect\u00e9s le plus t\u00f4t possible, garantissant ainsi une qualit\u00e9 et un rendement \u00e9lev\u00e9s.<\/p>\n\n\n\n<figure class=\"wp-block-table\"><table class=\"has-fixed-layout\"><thead><tr><th class=\"has-text-align-left\" data-align=\"left\">Processus d'inspection<\/th><th class=\"has-text-align-left\" data-align=\"left\">Standard<\/th><th class=\"has-text-align-left\" data-align=\"left\">Avanc\u00e9<\/th><\/tr><\/thead><tbody><tr><td>Test de liste de filets de sonde volante<\/td><td>Oui<\/td><td>Oui<\/td><\/tr><tr><td>Contr\u00f4le d'imp\u00e9dance TDR<\/td><td>Oui<\/td><td>Oui<\/td><\/tr><tr><td>Inspection AOI et tests Hi-Pot<\/td><td>Oui<\/td><td>Oui<\/td><\/tr><tr><td>Contrainte thermique<\/td><td>Oui<\/td><td>Oui<\/td><\/tr><tr><td>Test de pelage<\/td><td>Oui<\/td><td>Oui<\/td><\/tr><tr><td>Rondelles de section transversale<\/td><td>Oui<\/td><td>Oui<\/td><\/tr><tr><td>Soudabilit\u00e9<\/td><td>Oui<\/td><td>Oui<\/td><\/tr><tr><td>Coupons d'imp\u00e9dance<\/td><td>Oui<\/td><td>Oui<\/td><\/tr><tr><td>Coupon AB<\/td><td>Oui<\/td><td>Oui<\/td><\/tr><\/tbody><\/table><\/figure>\n\n\n                <\/div>\n            <\/div>\n        <\/div>\n    <\/div>\n<\/section>\n\n\n<section class=\"cta padding-small fz-small \">\n            <picture data-fade>\n 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https:\/\/summitinterconnect.com\/wp-content\/uploads\/sites\/2\/2026\/05\/Mask-group-507x169.webp 507w\" sizes=\"auto, (max-width: 2560px) 100vw, 2560px\" \/>        <\/picture>\n        <div class=\"container cta__container\">\n        <div class=\"cta__info\">\n            <div class=\"cta__content-wrapper\" data-fade-up>\n                                    <h2 class=\"cta__title h4-to-h6\">\n                        Aper\u00e7u des capacit\u00e9s de fabrication                    <\/h2>\n                            <\/div>\n                            <div class=\"cta__buttons-wrapper\" data-fade-up>\n                        <a href=\"https:\/\/summitinterconnect.ca\/wp-content\/uploads\/2023\/01\/Summit-Capabilities-All-Facilities-Combined.pdf\" target=\"\"\n       class=\"btn cta__btn --big --dark\"\n            >\n        <span class=\"btn__icon btn__icon--left\"><\/span>\n        <span class=\"btn__text\">T\u00e9l\u00e9charger les capacit\u00e9s de Summit <\/span>\n        <span class=\"btn__icon btn__icon--right\"><\/span>\n    <\/a>\n                <\/div>\n                    <\/div>\n    <\/div>\n<\/section>\n\n\n<section class=\"faq-solutions subtitle-width-400-385 bg-white align wp-block-acf-faq-solutions-block\">\n    <div class=\"container-big badge__container\">\n                    <div class=\"badge\" data-fade-up>FAQ<\/div>\n            <\/div>\n    <div class=\"container\">\n        <div class=\"faq-solutions__content-side\">\n            <div class=\"faq-solutions__headline\">\n                    <h2 class=\"section-decor-title h1-to-h1-mobile \">\n    <span class=\"section-decor-title__inner\">\n                            <svg class=\"title-decor\" aria-hidden=\"true\" width=\"350\" height=\"106\" viewBox=\"0 0 350 106\" fill=\"none\" xmlns=\"http:\/\/www.w3.org\/2000\/svg\">\n<path opacity=\"0.3\" d=\"M281.381 72.6288V51.4504C283.803 50.765 285.62 48.4347 285.62 45.7617C285.62 42.4718 282.996 39.7988 279.767 39.7988C276.538 39.7988 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148.783 54.0517C151.461 54.0517 153.796 52.2034 154.483 49.739H201.387L208.735 57.0637C208.392 57.8166 208.117 58.7066 208.117 59.5965C208.117 62.8823 210.795 65.552 214.091 65.552C217.388 65.552 220.066 62.8823 220.066 59.5965C220.066 56.3107 217.319 53.7094 214.023 53.7094ZM148.783 50.7659C147.341 50.7659 146.105 49.6021 146.105 48.0961C146.105 46.6586 147.272 45.4264 148.783 45.4264C150.225 45.4264 151.461 46.5901 151.461 48.0961C151.393 49.6021 150.225 50.7659 148.783 50.7659ZM214.023 62.2662C212.581 62.2662 211.345 61.1025 211.345 59.5965C211.345 58.1589 212.512 56.9267 214.023 56.9267C215.465 56.9267 216.701 58.0905 216.701 59.5965C216.701 61.1025 215.534 62.2662 214.023 62.2662Z\" fill=\"#9B9B9B\"\/>\n<\/svg>\n                        <span class=\"section-decor-title__title-text\" data-text-splitter data-fade-up-title>\n                Foire Aux Questions:            <\/span>\n        <\/span>\n    <\/h2>\n            <\/div>\n            <ul data-acc=\"true\" data-open-one class=\"faq-solutions__list\" data-fade-up>\n                                    <li data-acc-item class=\"faq-solutions__list-item faq-solutions-list-item\">\n                        <button data-acc-title type=\"button\" name=\"open accordion\">\n                            Combien de couches Summit Interconnect peut-il fabriquer ?                            <span aria-hidden=\"true\" class=\"faq-solutions-list-item__decor\">\n                                <svg aria-hidden=\"true\" xmlns=\"http:\/\/www.w3.org\/2000\/svg\" width=\"10\" height=\"10\" viewBox=\"0 0 10 10\" fill=\"none\">\n    <path d=\"M0.599609 5.00065H9.39961M9.39961 5.00065L6.09961 1.33398M9.39961 5.00065L6.09961 8.66732\" stroke=\"black\" stroke-linecap=\"round\" stroke-linejoin=\"round\"\/>\n<\/svg>                            <\/span>\n                        <\/button>\n                        <div data-acc-content>\n                            <div class=\"accordion-content-body\">\n                                <p>Summit peut fabriquer des PCB allant de simples cartes \u00e0 2 couches \u00e0 des conceptions tr\u00e8s complexes avec 30 couches et plus en standard, et des capacit\u00e9s \u00e9mergentes s'\u00e9tendent au-del\u00e0 de 44 couches.<\/p>\n                            <\/div>\n                        <\/div>\n                    <\/li>\n                                    <li data-acc-item class=\"faq-solutions__list-item faq-solutions-list-item\">\n                        <button data-acc-title type=\"button\" name=\"open accordion\">\n                            Quelle est la taille de panneau maximale que Summit peut fabriquer ?                            <span aria-hidden=\"true\" class=\"faq-solutions-list-item__decor\">\n                                <svg aria-hidden=\"true\" xmlns=\"http:\/\/www.w3.org\/2000\/svg\" width=\"10\" height=\"10\" viewBox=\"0 0 10 10\" fill=\"none\">\n    <path d=\"M0.599609 5.00065H9.39961M9.39961 5.00065L6.09961 1.33398M9.39961 5.00065L6.09961 8.66732\" stroke=\"black\" stroke-linecap=\"round\" stroke-linejoin=\"round\"\/>\n<\/svg>                            <\/span>\n                        <\/button>\n                        <div data-acc-content>\n                            <div class=\"accordion-content-body\">\n                                <p>La taille de panneau maximale standard est de 18\u2033 x 24\u2033, avec des capacit\u00e9s avanc\u00e9es allant jusqu'\u00e0 21\u2033 x 24\u2033 et des capacit\u00e9s \u00e9mergentes atteignant 24\u2033 x 36\u2033.<\/p>\n                            <\/div>\n                        <\/div>\n                    <\/li>\n                                    <li data-acc-item class=\"faq-solutions__list-item faq-solutions-list-item\">\n                        <button data-acc-title type=\"button\" name=\"open accordion\">\n                            Summit Interconnect propose-t-il des capacit\u00e9s HDI et de pressage s\u00e9quentiel ?                            <span aria-hidden=\"true\" class=\"faq-solutions-list-item__decor\">\n                                <svg aria-hidden=\"true\" xmlns=\"http:\/\/www.w3.org\/2000\/svg\" width=\"10\" height=\"10\" viewBox=\"0 0 10 10\" fill=\"none\">\n    <path d=\"M0.599609 5.00065H9.39961M9.39961 5.00065L6.09961 1.33398M9.39961 5.00065L6.09961 8.66732\" stroke=\"black\" stroke-linecap=\"round\" stroke-linejoin=\"round\"\/>\n<\/svg>                            <\/span>\n                        <\/button>\n                        <div data-acc-content>\n                            <div class=\"accordion-content-body\">\n                                <p>Oui, Summit propose des couches HDI et des laminations s\u00e9quentielles de 2-3 jusqu'\u00e0 7 couches selon le type de stratifi\u00e9.<\/p>\n                            <\/div>\n                        <\/div>\n                    <\/li>\n                                    <li data-acc-item class=\"faq-solutions__list-item faq-solutions-list-item\">\n                        <button data-acc-title type=\"button\" name=\"open accordion\">\n                            Dans quels types de vias Summit se sp\u00e9cialise-t-il ?                            <span aria-hidden=\"true\" class=\"faq-solutions-list-item__decor\">\n                                <svg aria-hidden=\"true\" xmlns=\"http:\/\/www.w3.org\/2000\/svg\" width=\"10\" height=\"10\" viewBox=\"0 0 10 10\" fill=\"none\">\n    <path d=\"M0.599609 5.00065H9.39961M9.39961 5.00065L6.09961 1.33398M9.39961 5.00065L6.09961 8.66732\" stroke=\"black\" stroke-linecap=\"round\" stroke-linejoin=\"round\"\/>\n<\/svg>                            <\/span>\n                        <\/button>\n                        <div data-acc-content>\n                            <div class=\"accordion-content-body\">\n                                <p>Summit se sp\u00e9cialise dans les technologies PCB avanc\u00e9es, notamment les microvias laser, les vias borgnes, les vias enterr\u00e9s et les vias dans les pastilles, avec des options de vias remplis de r\u00e9sine non conductrice, d'\u00e9poxy conducteur et de cuivre.<\/p>\n                            <\/div>\n                        <\/div>\n                    <\/li>\n                                    <li data-acc-item class=\"faq-solutions__list-item faq-solutions-list-item\">\n                        <button data-acc-title type=\"button\" name=\"open accordion\">\n                            Quelles sont les finitions de surface disponibles chez Summit Interconnect ?                            <span aria-hidden=\"true\" class=\"faq-solutions-list-item__decor\">\n                                <svg aria-hidden=\"true\" xmlns=\"http:\/\/www.w3.org\/2000\/svg\" width=\"10\" height=\"10\" viewBox=\"0 0 10 10\" fill=\"none\">\n    <path d=\"M0.599609 5.00065H9.39961M9.39961 5.00065L6.09961 1.33398M9.39961 5.00065L6.09961 8.66732\" stroke=\"black\" stroke-linecap=\"round\" stroke-linejoin=\"round\"\/>\n<\/svg>                            <\/span>\n                        <\/button>\n                        <div data-acc-content>\n                            <div class=\"accordion-content-body\">\n                                <p>Summit propose des finitions HASL (avec et sans plomb), \u00e9tain blanc, ENEPIG, ENIG, argent par immersion et Entek Plus HT\/OSP pour les applications standard et avanc\u00e9es.<\/p>\n                            <\/div>\n                        <\/div>\n                    <\/li>\n                                    <li data-acc-item class=\"faq-solutions__list-item faq-solutions-list-item\">\n                        <button data-acc-title type=\"button\" name=\"open accordion\">\n                            Summit propose-t-il des services d&#039;assemblage de PCB en plus de la fabrication ?                            <span aria-hidden=\"true\" class=\"faq-solutions-list-item__decor\">\n                                <svg aria-hidden=\"true\" xmlns=\"http:\/\/www.w3.org\/2000\/svg\" width=\"10\" height=\"10\" viewBox=\"0 0 10 10\" fill=\"none\">\n    <path d=\"M0.599609 5.00065H9.39961M9.39961 5.00065L6.09961 1.33398M9.39961 5.00065L6.09961 8.66732\" stroke=\"black\" stroke-linecap=\"round\" stroke-linejoin=\"round\"\/>\n<\/svg>                            <\/span>\n                        <\/button>\n                        <div data-acc-content>\n                            <div class=\"accordion-content-body\">\n                                <p>Oui, Summit propose un assemblage PCB cl\u00e9 en main complet incluant le CMS simple et double face, l'assemblage traversant, le placement BGA, ainsi que des services suppl\u00e9mentaires tels que le montage en bo\u00eetier, le rev\u00eatement conforme et les tests fonctionnels.<\/p>\n                            <\/div>\n                        <\/div>\n                    <\/li>\n                                    <li data-acc-item class=\"faq-solutions__list-item faq-solutions-list-item\">\n                        <button data-acc-title type=\"button\" name=\"open accordion\">\n                            Quelles sont les certifications qualit\u00e9 d\u00e9tenues par Summit Interconnect ?                            <span aria-hidden=\"true\" class=\"faq-solutions-list-item__decor\">\n                                <svg aria-hidden=\"true\" xmlns=\"http:\/\/www.w3.org\/2000\/svg\" width=\"10\" height=\"10\" viewBox=\"0 0 10 10\" fill=\"none\">\n    <path d=\"M0.599609 5.00065H9.39961M9.39961 5.00065L6.09961 1.33398M9.39961 5.00065L6.09961 8.66732\" stroke=\"black\" stroke-linecap=\"round\" stroke-linejoin=\"round\"\/>\n<\/svg>                            <\/span>\n                        <\/button>\n                        <div data-acc-content>\n                            <div class=\"accordion-content-body\">\n                                <p>Summit Interconnect maintient des certifications qualit\u00e9 compl\u00e8tes, notamment AS9100D, <span dir=\"ltr\" role=\"presentation\">la classe II et III IPC, l'enregistrement ITAR et la conformit\u00e9 RoHS. Les certifications varient selon <\/span><span dir=\"ltr\" role=\"presentation\">le site en fonction des capacit\u00e9s sp\u00e9cialis\u00e9es.<\/span><\/p>\n<p>Consultez nos certifications par site ou contactez-nous pour associer votre projet au bon site certifi\u00e9.<\/p>\n                            <\/div>\n                        <\/div>\n                    <\/li>\n                                    <li data-acc-item class=\"faq-solutions__list-item faq-solutions-list-item\">\n                        <button data-acc-title type=\"button\" name=\"open accordion\">\n                            Quelle est la largeur de piste et l&#039;isolement minimaux que Summit peut r\u00e9aliser ?                            <span aria-hidden=\"true\" class=\"faq-solutions-list-item__decor\">\n                                <svg aria-hidden=\"true\" xmlns=\"http:\/\/www.w3.org\/2000\/svg\" width=\"10\" height=\"10\" viewBox=\"0 0 10 10\" fill=\"none\">\n    <path d=\"M0.599609 5.00065H9.39961M9.39961 5.00065L6.09961 1.33398M9.39961 5.00065L6.09961 8.66732\" stroke=\"black\" stroke-linecap=\"round\" stroke-linejoin=\"round\"\/>\n<\/svg>                            <\/span>\n                        <\/button>\n                        <div data-acc-content>\n                            <div class=\"accordion-content-body\">\n                                <p><span dir=\"ltr\" role=\"presentation\">Pour <\/span><span dir=\"ltr\" role=\"presentation\">les couches internes avec du cuivre de 1\/2 oz, Summit peut atteindre des pistes de 0,003\u2033\/0,003\u2033 <\/span>largeur\/espacement dans les capacit\u00e9s avanc\u00e9es, avec des capacit\u00e9s \u00e9mergentes inf\u00e9rieures \u00e0 0,0025\u2033\/0,002\u2033.<\/p>\n                            <\/div>\n                        <\/div>\n                    <\/li>\n                            <\/ul>\n        <\/div>\n        <div class=\"faq-solutions__decor-image\" aria-hidden=\"true\" data-fade data-dyration=\"1\">\n            <img decoding=\"async\"\n                src=\"https:\/\/summitinterconnect.ca\/wp-content\/themes\/summit\/gb-blocks\/global-blocks\/faq-solutions-block\/images\/decor-image.webp\"\n                alt=\"decor image\">\n        <\/div>\n    <\/div>\n<\/section>\n","protected":false},"excerpt":{"rendered":"","protected":false},"author":6,"featured_media":0,"parent":0,"menu_order":0,"comment_status":"closed","ping_status":"closed","template":"","meta":{"_acf_changed":false,"content-type":"","footnotes":""},"class_list":["post-14730","page","type-page","status-publish","hentry"],"acf":[],"yoast_head":"<!-- This site is optimized with the Yoast SEO plugin v27.8 - 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