{"version":"1.0","provider_name":"Summit Interconnect CA","provider_url":"https:\/\/summitinterconnect.ca\/fr\/","title":"Le vice-pr\u00e9sident de la technologie de Summit fera une pr\u00e9sentation \u00e0 l'IPC APEX Expo 2022","type":"rich","width":600,"height":338,"html":"<blockquote class=\"wp-embedded-content\" data-secret=\"Jg1evnCD1r\"><a href=\"https:\/\/summitinterconnect.ca\/fr\/blog\/article\/ipc-apex-expo-summit-vp-technology-presenting\/\">Le vice-pr\u00e9sident de la technologie de Summit fera une pr\u00e9sentation \u00e0 l'IPC APEX Expo 2022<\/a><\/blockquote><iframe sandbox=\"allow-scripts\" security=\"restricted\" src=\"https:\/\/summitinterconnect.ca\/fr\/blog\/article\/ipc-apex-expo-summit-vp-technology-presenting\/embed\/#?secret=Jg1evnCD1r\" width=\"600\" height=\"338\" title=\"&#8220;Le vice-pr\u00e9sident de la technologie de Summit fera une pr\u00e9sentation \u00e0 l&#039;IPC APEX Expo 2022&#8221; &#8212; Summit Interconnect CA\" data-secret=\"Jg1evnCD1r\" frameborder=\"0\" marginwidth=\"0\" marginheight=\"0\" scrolling=\"no\" class=\"wp-embedded-content\"><\/iframe><script type=\"text\/javascript\">\n\/* <![CDATA[ *\/\n\/*! This file is auto-generated *\/\n!function(d,l){\"use strict\";l.querySelector&&d.addEventListener&&\"undefined\"!=typeof URL&&(d.wp=d.wp||{},d.wp.receiveEmbedMessage||(d.wp.receiveEmbedMessage=function(e){var t=e.data;if((t||t.secret||t.message||t.value)&&!\/[^a-zA-Z0-9]\/.test(t.secret)){for(var s,r,n,a=l.querySelectorAll('iframe[data-secret=\"'+t.secret+'\"]'),o=l.querySelectorAll('blockquote[data-secret=\"'+t.secret+'\"]'),c=new RegExp(\"^https?:$\",\"i\"),i=0;i<o.length;i++)o[i].style.display=\"none\";for(i=0;i<a.length;i++)s=a[i],e.source===s.contentWindow&&(s.removeAttribute(\"style\"),\"height\"===t.message?(1e3<(r=parseInt(t.value,10))?r=1e3:~~r<200&&(r=200),s.height=r):\"link\"===t.message&&(r=new URL(s.getAttribute(\"src\")),n=new URL(t.value),c.test(n.protocol))&&n.host===r.host&&l.activeElement===s&&(d.top.location.href=t.value))}},d.addEventListener(\"message\",d.wp.receiveEmbedMessage,!1),l.addEventListener(\"DOMContentLoaded\",function(){for(var e,t,s=l.querySelectorAll(\"iframe.wp-embedded-content\"),r=0;r<s.length;r++)(t=(e=s[r]).getAttribute(\"data-secret\"))||(t=Math.random().toString(36).substring(2,12),e.src+=\"#?secret=\"+t,e.setAttribute(\"data-secret\",t)),e.contentWindow.postMessage({message:\"ready\",secret:t},\"*\")},!1)))}(window,document);\n\/* ]]> *\/\n<\/script>\n","description":"Gerry Partida, vice-pr\u00e9sident de la technologie chez Summit Interconnect, une soci\u00e9t\u00e9 de fabrication de circuits imprim\u00e9s, explique que la fiabilit\u00e9 de Microvia est souvent \u00e9voqu\u00e9e avec la fabrication de circuits imprim\u00e9s \u00e0 l'aide d'une fabrication rapide.","thumbnail_url":"https:\/\/summitinterconnect.com\/wp-content\/uploads\/2022\/01\/ApexExpoImage.jpg","thumbnail_width":624,"thumbnail_height":621}